Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.
1. A package comprising:
a first substrate comprising a flexible substrate comprising a polymeric transparent film;
an organic electronic device coupled to the transparent film;
a sealant coupled to the transparent film and disposed about the perimeter of the organic electronic device;
a second substrate comprising a superstrate coupled to the sealant and disposed proximate the organic electronic device; and
an edge seal coupled to each of the flexible substrate and the superstrate and configured to hermetically seal peripheral edges of the package.
2. The package, as set forth in claim 1 , wherein the flexible substrate comprises the bather coating.
3. The package, as set forth in claim 1 , wherein the flexible substrate is a composite substrate comprising:
a first protective layer configured to resist abrasion;
a polymeric transparent film coupled to the first protective layer;
a barrier coating coupled to the transparent film; and
a second protective layer coupled to the barrier coating and configured to protect the transparent film from chemical attach during fabrication.
4. The package, as set forth in claim 1 , wherein the flexible substrate is a composite substrate comprising:
a first protective layer configured to resist abrasion;
a first polymeric transparent film coupled to the first protective layer;
a first bather coating coupled to the first transparent film;
a second barrier coating coupled to the first barrier coating via an adhesive layer;
a second polymeric transparent film coupled to the second barrier coating; and
a second protective layer coupled to the barrier coating and configured to protect the transparent film from chemical attach during fabrication.
5. The package, as set forth in claim 1 , comprising a barrier coating coupled between the flexible substrate and the organic electronic device.
6. The package, as set forth in claim 1 , wherein the organic electronic device comprises an organic light emitting diode.
7. The package, as set forth in claim 1 , wherein the organic electronic device comprises an organic photovoltaic device.
8. The package, as set forth in claim 1 , wherein the sealant comprises an adhesive material having a low permeability.
9. The package, as set forth in claim 1 , wherein the sealant comprises a thickness that is greater than a thickness of the organic electronic device.
10. The package, as set forth in claim 1 , wherein the superstrate comprises a metal foil.
11. The package, as set forth in claim 1 , comprising a desiccant material disposed within pockets formed by the edge seal.
12. The package, as set forth in claim 1 , wherein the edge seal comprises a metal foil.
13. A package comprising:
a first substrate, wherein peripheral edges of the first substrate are covered with a first edge seal configured to hermetically seal peripheral edges of the first substrate;
an organic electronic device disposed on the first substrate; and
a second substrate disposed proximate to the orgainic electronic device and coupled to the first substrate via a sealant.
14. The package, as set forth in claim 13 , wherein the peripheral edges of the second substrate are covered with a second edge seal configured to hermetically seal peripheral edges of the second substrate.
15. The package, as set forth in claim 13 , wherein each of the first substrate and the second substrate comprises a composite substrate.
16. The package, as set forth in claim 13 , wherein the first substrate is a composite substrate comprising:
a first protective layer configured to resist abrasion;
a polymeric transparent film coupled to the first protective layer;
a barrier coating coupled to the transparent film; and
a second protective layer coupled to the barrier coating and configured to protect the transparent film from chemical attach during fabrication.
17. The package, as set forth in claim 13 , wherein the first substrate is a composite substrate comprising:
a first protective layer configured to resist abrasion;
a first polymeric transparent film coupled to the first protective layer;
a first barrier coating coupled to the first transparent film;
a second barrier coating coupled to the first barrier coating via an adhesive layer;
a second polymeric transparent film coupled to the second bather coating; and
a second protective layer coupled to the barrier coating and configured to protect the transparent film from chemical attach during fabrication.
18. The package, as set forth in claim 13 , wherein the sealant comprises an adhesive material having a low permeability.
19. The package, as set forth in claim 13 , wherein the first edge seal comprises a metal foil.
20. A package comprising:
a first composite substrate, wherein peripheral edges of the first composite substrate are covered with a first edge seal;
a second composite substrate, wherein peripheral edges of the second composite substrate are covered with a second edge seal; and
an organic electronic device disposed between the first composite substrate and the second composite substrate, wherein the first composite substrate is coupled to the second composite substrate via a sealant.
21. The package, as set forth in claim 20 , wherein each of the first composite substrate and the second composite substrate comprises:
a first protective layer configured to resist abrasion;
a polymeric transparent film coupled to the first protective layer;
a barrier coating coupled to the transparent film; and
a second protective layer coupled to the barrier coating and configured to protect the transparent film from chemical attach during fabrication.
22. The package, as set forth in claim 20 , wherein each of the first composite substrate and the second composite substrate comprises:
a first protective layer configured to resist abrasion;
a first polymeric transparent film coupled to the first protective layer;
a first barrier coating coupled to the first transparent film;
a second barrier coating coupled to the first barrier coating via an adhesive layer;
a second polymeric transparent film coupled to the second barrier coating; and
a second protective layer coupled to the barrier coating and configured to protect the transparent film from chemical attach during fabrication.
23. The package, as set forth in claim 20 , wherein the organic electronic device comprises an organic light emitting diode.
24. The package, as set forth in claim 20 , wherein the organic electronic device comprises an organic photovoltaic device.
25. The package, as set forth in claim 20 , wherein the sealant comprises an adhesive material having a low permeability.
26. The package, as set forth in claim 20 , comprising a desiccant material disposed within pockets formed by each of the edge seals.
27. The package, as set forth in claim 20 , wherein each of the edge seals comprises a metal foil.