Subfloor component and method of manufacturing same
View Patent ↗A subfloor component includes an insulating foam panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross-section, a plurality of pedestals having walls that extend into the panel from the first face toward the second face. The subfloor component also includes a moisture-resistant film attached to the first face of the panel and that conforms to the pedestals, and a hardboard layer on the second face of the panel. A method of manufacturing subfloor components is also disclosed.
1. A subfloor component comprising:
an insulating rigid foam panel having first and second opposing faces and a plurality of intersecting grooves to define, in cross-section, a plurality of pedestals, each pedestal having at least one wall extending into the panel from the first face toward the second face;
a film of moisture-impervious material attached to the first face of the panel that conforms to the tops and walls of the pedestals and to the bottoms of the grooves; and
a hardboard layer on the second face of the panel.
2. The subfloor component of claim 1 , wherein the film is fused to the panel.
3. The subfloor component of claim 1 , wherein the film comprises material selected from the group comprising plastic or polymer.
4. The subfloor component of claim 1 , wherein each of the plurality of pedestals has a single wall.
5. The subfloor component of claim 4 , wherein the pedestals are shaped as circles or ellipses.
6. The subfloor component of claim 1 , wherein the panel comprises expanded polystyrene (EPS).
7. The subfloor component of claim 1 , wherein the hardboard layer and the panel are attached to each other with glue.
8. The subfloor component of claim 1 , wherein the intersecting grooves are rectangular.
9. The subfloor component of claim 8 , wherein the walls of the intersecting grooves have a height of about 15 millimeters to about 20 millimeters.
10. The subfloor component of claim 8 , wherein the width of the intersecting grooves is about 15 millimeters to about 20 millimeters.
11. The subfloor component of claim 1 , wherein the pedestals are shaped as at least one of circles, ellipses, rectangles, diamonds, squares, and hexagons.
12. The subfloor component of claim 1 , wherein the hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board.
13. The subfloor component of claim 1 , wherein the subfloor component is shaped to connect to another subfloor component.
14. The subfloor component of claim 13 , wherein the hardboard layer comprises a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.
15. The subfloor component of claim 1 , wherein the pedestals are generally uniformly distributed across the first surface of the panel.
16. The subfloor component of claim 3 , wherein the plastic or polymer is selected from the group consisting of: high-impact polystyrene, polyethylene, and ABS (Acrylonitrile Butadiene Styrene).
17. The subfloor component of claim 1 , wherein the film is attached to at least one of: the tops of the pedestals, the walls of the pedestals, and the bottoms of the grooves.
18. The subfloor component of claim 1 , wherein the film is attached to at least two of: the tops of the pedestals, the walls of the pedestals, and the bottoms of the grooves.