Wafer dicing used hybrid multi-step laser scribing process with plasma etch
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The mask is composed of a layer covering and protecting the integrated circuits. The mask is patterned with a multi-step laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the integrated circuits.
1. A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
forming a mask above the semiconductor wafer, the mask comprising a layer covering and protecting the integrated circuits;
patterning the mask with a multi-step laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits, the multi-step laser scribing process comprising:
scribing with two or more offset but overlapping Gaussian beam passes; and, subsequently,
scribing with a top hat beam pass overlapping the Gaussian beam passes; and
etching the semiconductor wafer through the gaps in the patterned mask to singulate the integrated circuits.
2. The method of claim 1 , wherein the two or more offset but overlapping Gaussian beam passes are performed sequentially.
3. The method of claim 1 , wherein the two or more offset but overlapping Gaussian beam passes are performed simultaneously.
4. The method of claim 1 , wherein each of the two or more offset but overlapping Gaussian beam passes are performed using a UV laser having a wavelength approximately in the range of 300-380 nanometers.
5. The method of claim 1 , wherein each of the two or more offset but overlapping Gaussian beam passes are performed using a UV laser having a pulse width approximately in the range of 5-50 picoseconds.
6. The method of claim 1 , wherein each of the two or more offset but overlapping Gaussian beam passes are performed using a UV laser having a laser spot diameter approximately in the range of 25-50 microns.
7. The method of claim 1 , wherein the top hat beam pass is performed at approximately 25%-50% of the average fluence of the Gaussian beam passes.
8. The method of claim 1 , wherein forming the mask above the semiconductor wafer comprises forming a water soluble mask.
9. A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
forming a mask above the semiconductor wafer, the mask comprising a layer covering and protecting the integrated circuits;
patterning the mask with a multi-step laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits, the multi-step laser scribing process comprising:
scribing with two or more offset but overlapping Gaussian beam passes; and, subsequently,
scribing with a broad Gaussian beam pass overlapping the offset Gaussian beam passes; and
etching the semiconductor wafer through the gaps in the patterned mask to singulate the integrated circuits.
10. The method of claim 9 , wherein the two or more offset but overlapping Gaussian beam passes are performed sequentially.
11. The method of claim 9 , wherein the two or more offset but overlapping Gaussian beam passes are performed simultaneously.
12. The method of claim 9 , wherein each of the two or more offset but overlapping Gaussian beam passes are performed using a UV laser having a wavelength approximately in the range of 300-380 nanometers.
13. The method of claim 9 , wherein each of the two or more offset but overlapping Gaussian beam passes are performed using a UV laser having a pulse width approximately in the range of 5-50 picoseconds.
14. The method of claim 9 , wherein each of the two or more offset but overlapping Gaussian beam passes are performed using a UV laser having a laser spot diameter approximately in the range of 25-50 microns.
15. The method of claim 9 , wherein forming the mask above the semiconductor wafer comprises forming a water soluble mask.
16. A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:
forming a mask layer above a silicon substrate, the mask layer covering and protecting integrated circuits disposed on the silicon substrate, the integrated circuits comprising a layer of silicon dioxide disposed above a layer of low K material and a layer of copper;
patterning the mask layer, the layer of silicon dioxide, the layer of low K material, and the layer of copper with a multi-step laser scribing process to provide a patterned mask layer with gaps, exposing regions of the silicon substrate between the integrated circuits, the multi-step laser scribing process comprising:
scribing with two or more offset but overlapping Gaussian beam passes; and, subsequently,
scribing with a top hat beam pass or with a broad Gaussian beam pass overlapping the Gaussian beam passes; and
etching the silicon substrate through the gaps in the patterned mask layer to singulate the integrated circuits.
17. The method of claim 16 , wherein patterning the layer of silicon dioxide, the layer of low K material, and the layer of copper with the multi-step laser scribing process comprises ablating the layer of silicon dioxide prior to ablating the layer of low K material and the layer of copper.
18. The method of claim 16 , wherein the two or more offset but overlapping Gaussian beam passes are performed sequentially.
19. The method of claim 16 , wherein the two or more offset but overlapping Gaussian beam passes are performed simultaneously.
20. The method of claim 16 , wherein forming the mask layer above the silicon substrate comprises forming a water soluble mask layer.