Etch damage and ESL free dual damascene metal interconnect
A method of forming a dual damascene metal interconnect for a semiconductor device. The method includes forming a layer of low-k dielectric, forming vias through the low-k dielectric layer, depositing a sacrificial layer, forming trenches through the sacrificial layer, filling the vias and trenches with metal, removing the sacrificial layer, then depositing an extremely low-k dielectric layer to fill between the trenches. The method allows the formation of an extremely low-k dielectric layer for the second level of the dual damascene structure while avoiding damage to that layer by such processes as trench etching and trench metal deposition. The method has the additional advantage of avoiding an etch stop layer between the via level dielectric and the trench level dielectric.
1. A semiconductor device manufacturing process, comprising:
providing a semiconductor substrate;
forming gate structures on the substrate through front end of line processing;
forming a low-k dielectric layer over the gate structures;
patterning vias through the low-k dielectric layer;
forming a sacrificial layer over the low-k dielectric layer;
patterning trenches through the sacrificial layer;
filling the vias and trenches with metal;
removing the sacrificial layer;
forming an extremely low-k dielectric layer over the low-k dielectric layer; and
wherein the extremely low-k dielectric layer has a lower dielectric constant than the low-k dielectric layer.
2. The process of claim 1 , when the extremely low-k dielectric layer is deposited by a non-conformal deposition process.
3. The method of claim 1 , wherein the vias are patterned through the low-k dielectric layer without using a hard mask.
4. The method of claim 1 , wherein the low-k dielectric layer has an effective dielectric constant greater than 2.1 and the extremely low-k dielectric layer has an effective dielectric constant less than 2.1.
5. The method of claim 1 , wherein the wherein the low-k dielectric layer has a lower porosity than the extremely low-k dielectric layer.
6. The method of claim 1 , wherein the low-k dielectric layer is formed without air gaps and the extremely low-k dielectric layer is formed with air gaps.
7. The method of claim 1 , wherein the sacrificial layer comprises amorphous carbon.
8. The method of claim 7 , wherein the first dielectric layer is an organosilicate glass.
9. The method of claim 8 , wherein the trenches are patterned by plasma etching with an etch gas comprising NH 3 or a combination of N 2 and H 2 .
10. The method of claim 1 , wherein removing the sacrificial layer comprises etching with etch conditions that remove the material that makes up the sacrificial layer preferentially with respect to the material that makes up the low-k dielectric layer.