Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer the conductive particles to the planar insulating substrate, wherein the conductive particles are arranged to gather according to the predefined pattern. A sintering module is configured to fuse the conductive particles on the planar insulating substrate, wherein the conductive particles are arranged to fuse according to the predefined pattern to establish a conductive plane on the planar insulating substrate. Embodiment of the invention relate to printable or printing electronics on a fibrous web.
1. An apparatus, comprising
at least one module configured to establish a predefined pattern on a planar insulating substrate so that at least partly metallic conductive particles can gather according to the predefined pattern, wherein the planar insulating substrate is adapted to a shattering or deformation point below 300° C. without significant shattering or deformation at said temperature,
at least one another module configured to transfer the metallic conductive particles to the planar insulating substrate, wherein the metallic conductive particles are arranged to gather according to the predefined pattern, and
a sintering module configured to fuse at least partly the metallic conductive particles on the planar insulating substrate, wherein metal of the metallic conductive particles are arranged to at least partly fuse according to the predefined pattern so as to establish a conductive plane on the planar insulating substrate, wherein
the at least one module comprises a spreading module configured to spread a coupling agent on the planar insulating substrate, the coupling agent comprising charges so as to create a force of electric field for attracting the conductive particles and thereby establishing said predefined pattern according to which the conductive particles can gather.
2. The apparatus according to claim 1 , wherein the planar insulating substrate comprises a fiber based product, such as a fibrous web.
3. The apparatus according to claim 2 , wherein the fiber based product comprises a paper or a board or a polymeric film.
4. The apparatus according to claim 1 , wherein the conductive plane on the planar insulating surface comprises a portion of an electrical circuit, an electrical circuit or a chipset.
5. The apparatus according to claim 1 , wherein the spreading module comprises a cannon.
6. The apparatus according to claim 1 , wherein the spreading module comprises a roll and a container, wherein the roll is configured to transfer the coupling agent from the container to the substrate.
7. The apparatus according to any of claims 1 - 4 , 5 , and 6 , wherein the coupling agent comprises an adhesive.
8. The apparatus according to claim 1 , wherein the at least one module comprises an electric roll configured to establish the charges on a surface of the substrate according to the predefined pattern.
9. The apparatus according to claim 8 , wherein the at least one another module comprises another electric roll, which is configured to transfer the conductive particles from a container to the substrate so that the conductive particles are attached to the another electric roll by a force of electromagnetic field and transferred to the substrate and attached to the substrate by the charges situated on the surface of the substrate.
10. The apparatus according to claim 1 , wherein the at least one another module comprises a container for the conductive particles so that the conductive particles are transferrable to the surface of the substrate according to the predefined pattern.
11. The apparatus according to claim 10 , wherein charges on the surface of the substrate attracts the conductive particles to the surface and adhesive attaches the conductive particles to the surface according to the predefined pattern, wherein the adhesive and the charges both are situated according to the predefined pattern.
12. The apparatus according to claim 10 , wherein the at least one another module further comprises an electric roll configured to transfer the conductive particles from the container to the substrate so that the conductive particles are attached to the electric roll by a force of electromagnetic field and transferred to the substrate and attached to the substrate by an adhesive situated on the surface of the substrate.
13. The apparatus according to claim 10 , wherein the at least one another module further comprises a mask, a voltage source and a voltage drain to create charges according to the predefined pattern on the substrate, wherein the charges on the surface of the substrate attracts the conductive particles to the surface and adhesive attaches the conductive particles to the surface according to the predefined pattern.
14. The apparatus according to claim 13 , wherein the adhesive is uniformly distributed on the substrate so that the charges attracts the conductive particles according to the predefined pattern and adhesive attaches the conductive particles to the substrate.
15. The apparatus according to claim 1 , wherein the sintering module comprises two rolls, wherein at least one roll of the two rolls is heated.
16. The apparatus according to claim 15 , wherein the sintering module further comprises a blower heater.