Light emitting diode packaging structure
The present invention discloses an LED packaging structure, which comprises a metal housing having a cavity and two open ends, a sintered two-phase-flow heat transfer device having a flat top mounting plane, a lens disposed in the first open end, at least one LED chip mounted in the cavity of the metal housing and on the mounting plane of the two-phase-flow heat transfer device; the LED chip is connected with an electrical connection device, and wherein the sintered two-phase-flow, electrical connection device and LED chip are fixed together through a fixing base. Using a sintered two-phase-flow heat transfer device for heat dissipation, the heat generated by the LED could be expelled in time for dealing with long-term continual work, and thus the LED chip could have a longer service life. In addition, the lens used in the present invention could improve the luminescent efficiency.
1. An LED packaging structure, comprising:
a metal housing, having a cavity and two open ends, the cavity of the metal housing being bowl or taper shaped and provided with a smooth surface;
a lens, disposed in the first open end of the metal housing;
a sintered heat pipe, having a flat top mounting plane, and connected to the second open end of the metal housing;
at least one LED chip, having a wavelength is between 310 to 470 nm, disposed in the cavity of the metal housing and said at least one LED chip is mounted on the flat to mounting plane of the sintered heat pipe;
an electrical connection device, to connect the LED chip to an external circuit;
a fixing base, to fix the sintered heat pipe, the electrical connection device and the LED chip together;
wherein,
the lens is a Fresnel lens consisting of a plurality of homocentric structures;
the sintered heat pipe is provided with an external spiral groove for accommodating an extra heat pipe in a twisted manner, and
wherein an inner wall of the extra heat pipe is provided with grooves and a copper powder sintering portion and diameters of a majority of the copper powders of the copper powder sintering portion are greater than a width of the grooves.
2. The LED packaging structure according to claim 1 , wherein a tail of the electrical connection device extends through the fixing base to form external electrodes; the LED chip is selected from one of an ultra violet LED, purple LED, and blue LED; and the lens is coated by phosphor.