IP Library Granted Patent US 8,670,579
Granted Patent B2
US 8,670,579 · App. 12/694,285 · Granted Mar 11, 2014

MEMS microphone

Inventors: Zhi-Jiang Wu (Shenzhen, CN); Xing-Fu Chen (Shenzhen, CN); Yong-Ze Su (Shenzhen, CN)
Assignees: AAC Acoustic Technologies (Shenzhen) Co., Ltd.; American Audio Components, Inc.
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Quick Facts
Patent No.
US 8,670,579
App. No.
12/694,285
Granted
Mar 11, 2014
Kind
B2
Abstract

A MEMS microphone includes a cover, a housing engaging with the cover for forming a cavity, at least one transducer accommodated in the cavity, and a conductive case covering the cover and the sidewall of the housing. The housing includes a cover and a sidewall extending from the base. The conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening.

Claims (13)

1. A MEMS microphone, comprising:

a cover;

a housing engaging with the cover for forming a cavity, the housing comprising a base and a sidewall extending perpendicularly from the base;

at least one MEMS transducer accommodated in the cavity, the transducer having a back volume;

and a conductive case covering the cover and the sidewall of the housing for protecting the transducer against interference signals;

wherein the conductive case defines a first part covering the cover, a second part extending from the first part for covering the sidewall and a third part perpendicularly extending from the second part for covering a periphery part of the base, the third part forming an opening;

and wherein the cover is a printed circuit board, and the housing includes circuits embedded therein for electrically connecting with the cover;

and wherein the cover defines a recess, and the sidewall of the housing defines a protrusion for engaging with the recess.

2. The MEMS microphone as described in claim 1 , wherein the cover defines an acoustic hole for receiving acoustic signals.

3. The MEMS microphone as described in claim 2 , wherein the transducer is mounted on the cover and overlaps at least a portion of the acoustic hole.

4. The MEMS microphone as described in claim 2 , wherein the back volume of the transducer communicates with the acoustic hole.

5. The MEMS microphone as described in claim 2 , wherein the conductive case defines an acoustic aperture communicating with the acoustic hole.

6. The MEMS microphone as described in claim 1 , wherein the cover defines a first group of terminals for electrically connecting with the circuits in the sidewall of the housing and a second group of terminals for electrically connecting with the transducer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2010
From: WU, ZHI-JIANG; CHEN, XING-FU; SU, YONG-ZE
To: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.; AMERICAN AUDIO COMPONENTS INC.
Reel/Frame 023851/0701 →
Priority Claims (1)
CN 2009 1 0108215 · Jun 19, 2009 · national
Continuity (1)
Related Publication 20100322443A1 · Dec 23, 2010