IP Library Granted Patent US 8,675,897
Granted Patent B2
US 8,675,897 · App. 12/996,444 · Granted Mar 18, 2014

Ear-muff type headset for two-way communication

Inventors: Mikio Fukuda (Tokyo, JP); Tomoya Atsumi (Tokyo, JP); Shouji Fujino (Tokyo, JP)
Assignee: Temco Japan Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,675,897
App. No.
12/996,444
Granted
Mar 18, 2014
Kind
B2
Abstract

It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1 , and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.

Claims (14)

1. An ear-muff type headset for two-way communication comprising:

a pair of bowl-shaped housings each having an annular pad attached to a rim of an opening portion connected together through a headband;

an acoustic speaker supported by a buffer material arranged in at least one of the pair of bowl-shaped housings; and

a bone conduction microphone supported by the buffer material such that a distal end thereof is brought into abutment against at least one of an ear and a portion around the ear upon a user wearing the headset, wherein the bone conduction microphone is provided in at least one of the pair of bowl-shaped housings;

wherein the bone conduction microphone is supported so as to be extensible toward and retractable away from an opening surface of at least one of the pair of bowl-shaped housings;

wherein at least one of the pair of bowl-shaped housings include a support base formed on an inner bottom surface of the at least one of the pair of bowl-shaped housings, an outer tube supported by the support base to slide within a circular hole formed in the buffer material, an elastic body interposed between the support base and the outer tube to act to restore the outer tube to an original position, and an inner tube fitted within an end portion of the outer tube;

wherein the bone conduction microphone is held so as to be exposed from a distal end portion of the inner tube through an anti-vibration weight mounted within the outer tube and an elastic member fixed thereto.

2. An ear-muff type headset for two-way communication:

a pair of bowl-shaped housings each having an annular pad attached to a rim of an opening portion, wherein the pair of bowl-shaped housings are connected to each other through a headband;

a bone conduction speaker supported by a buffer material such that a distal end thereof is brought into abutment against at least one of an ear or a portion around the ear upon a user wearing the headset, wherein the bone conduction speaker is provided in at least one of the pair of bowl-shaped housings; and

a bone conduction microphone supported by the buffer material such that a distal end thereof is brought into abutment against at least one of the ear or the portion around the ear upon the user wearing the headset, wherein the bone conduction microphone is provided in at least one of the housings;

wherein the bone conduction microphone and bone conduction speaker are supported so as to be extensible toward and retractable away from an opening surface of at least one of the pair of bowl-shaped housings;

wherein at least one of the pair of bowl-shaped housings include a support base formed on an inner bottom surface of the at least one of the pair of bowl-shaped housings, an outer tube supported by the support base to slide within a circular hole formed in the buffer material, an elastic body interposed between the support base and the outer tube to act to restore the outer tube to an original position, and an inner tube fitted within an end portion of the outer tube;

wherein the bone conduction microphone is held so as to be exposed from a distal end portion of the inner tube through an anti-vibration weight mounted within the outer tube and an elastic member fixed thereto.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2010
From: FUKUDA, MIKIO; ATSUMI, TOMOYA; FUJINO, SHOUJI
To: TEMCO JAPAN CO., LTD.
Reel/Frame 025451/0611 →
Priority Claims (1)
JP 2008-227238 · Sep 4, 2008 · national
Continuity (1)
Related Publication 20110170718A1 · Jul 14, 2011