Method for making a bottom electrode geometry for phase change memory
A PCRAM cell has a gradated or layered resistivity bottom electrode with higher resistivity closer to a phase change material, to provide partial heating near the interface between the cell and the bottom electrode, preventing separation of the amorphous GST region from the bottom electrode, and reducing the programming current requirements. The bottom electrode can also be tapered to have a smaller cross-sectional area at the top of the bottom electrode than at the bottom of the bottom electrode.
1. A method of forming a phase change memory cell, comprising:
forming a bottom electrode having a resistivity gradient with increasing resistivity between a bottom of the bottom electrode and a top of the bottom electrode;
forming a phase change memory element above the bottom electrode; and
forming a top electrode over the phase change memory element.
2. The method of claim 1 , wherein the bottom electrode with resistivity gradient is formed using a process of increasing Nitrogen concentration in the bottom electrode material to increase resistivity.
3. The method of claim 1 , wherein forming the bottom electrode comprises forming the bottom electrode as a single layer.
4. The method of claim 1 , wherein the bottom electrode is formed with a gradated resistivity having a lower resistivity at a bottom of the bottom electrode and gradually increasing in resistivity to a substantially higher resistivity at a top of the bottom electrode.
5. The method of claim 1 , wherein the bottom electrode is formed in a conical shape with a cross-sectional area that decreases toward the top of the bottom electrode.
6. The method of claim 1 , wherein the bottom electrode is formed having a resistivity less than 1 milliohm·cm at the bottom of the bottom electrode.
7. The method of claim 1 , wherein the bottom electrode is formed having a resistivity greater than 1 milliOhm·cm at the top of the bottom electrode.
8. The method of claim 1 , wherein the phase change material is formed from a chalcogenide.
9. The method of claim 1 , wherein the phase change material is formed from a Germanium-Antimony-Tellurium alloy.
10. A method of forming a phase change memory cell, comprising:
forming a resistivity gradated layer of bottom electrode material over a metal contact, the resistivity gradated layer having increasingly high resistivity from a lowest resistivity at a bottom of the bottom electrode to a highest resistivity at a top of the bottom electrode; and
tapering the bottom electrode to a shape having its largest cross-sectional area at its lowest resistivity and its smallest cross-sectional area at its highest resistivity.
11. The method of claim 10 , wherein forming the resistivity gradated layer comprises forming a single layer.
12. The method of claim 10 , wherein forming the resistivity gradated layer comprises forming a layer having a resistivity less than 1 milliOhm·cm at the bottom of the bottom electrode and a resistivity greater than 1 milliOhm·cm at the top of the bottom electrode.
13. The method of claim 10 , wherein tapering the bottom electrode further comprises tapering to a conical shape.
14. The method of claim 10 , wherein the bottom electrode with resistivity gradient is formed using a process of increasing Nitrogen concentration in the bottom electrode material to increase resistivity.
15. The method of claim 10 , wherein the bottom electrode is formed having a resistivity less than 1 milliOhm·cm at the bottom of the bottom electrode.
16. The method of claim 10 , wherein the bottom electrode is formed having a resistivity greater than 1 milliOhm·cm at the top of the bottom electrode.
17. The method of claim 10 , wherein the phase change material is formed from a chalcogenide.
18. The method of claim 10 , wherein the phase change material is formed from a Germanium-Antimony-Tellurium alloy.
19. A method of forming a phase change memory cell, comprising:
forming a resistivity gradated layer of bottom electrode material over a metal contact, the resistivity gradated layer having increasingly high resistivity from a lowest resistivity at a bottom of the bottom electrode to a highest resistivity at a top of the bottom electrode;
forming a phase change memory element above the bottom electrode; and
forming a top electrode over the phase change memory element.
20. The method of claim 19 , and further comprising tapering the bottom electrode to a conical shape having its largest cross-sectional area at its lowest resistivity and its smallest cross-sectional area at its highest resistivity.