Production process for a semi-conductor device and semi-conductor device
A process for producing a semiconductor device comprises the following process steps: provision of a semiconductor substrate ( 1 ); formation of a functional layer ( 2 ) on a semiconductor surface ( 11 ) of the semiconductor substrate ( 1 ); and production of at least one doped section ( 3 ) on the semiconductor surface ( 11 ) by driving a dopant into the semiconductor substrate ( 1 ) from the functional layer ( 2 ). The functional layer ( 2 ) is formed in such a way that it passivates the semiconductor surface ( 11 ), acting as a passivation layer upon completion of the semiconductor device.
1. A process for producing a semi-conductor device, comprising the following process steps:
forming a metal oxide functional layer on a semi-conductor surface of the semi-conductor substrate;
cleaving metal dopant from the metal oxide by applying an energy input to at least one section of the functional layer; and
driving in the cleaved metal dopant into the semi-conductor substrate for producing at least one doped section on the semi-conductor surface, wherein the step of applying the energy input and driving-in the cleaved dopant forms at least one opening in the functional layer.
2. The process according to claim 1 , characterized in that the cleaved dopant is driven into the semi-conductor substrate from the functional layer by a localized energy input.
3. The process according to claim 2 , characterized in that the localized energy input is provided using a laser source.
4. The process according to claim 1 , further wherein the step of applying the energy input and driving-in the cleaved dopant forms an opening through the functional layer at each of the at least one section of the functional layer.
5. The process according to claim 4 , further comprising applying a contact layer on the functional layer which electrically contacts the semi-conductor substrate at the doped section through the opening.
6. The process according to claim 1 , characterized in that the functional layer is made of a metal oxide.
7. The process according to claim 6 , characterized in that the functional layer comprises aluminum oxide and that the cleaved dopant comprises aluminum.
8. The process according to claim 1 , characterized in that immediately before the functional layer is formed, the semi-conductor substrate contains at the semi-conductor surface essentially the same amount of a dopant as present in a volume of the semi-conductor substrate.
9. The process according to claim 1 , further comprising, before the step of forming the functional layer, producing
doping sections on the semi-conductor surface, the doping in the doping sections being increased and/or inverted locally by said driving-in of the cleaved dopant from the functional layer into layer into the semi-conductor substrate.
10. The process according to claim 1 , characterized in that the semi-conductor substrate is a p-type or n-type semi-conductor in its volume.
11. The process according to claim 1 , further comprising forming a semi-conductor solar cell out of the semi-conductor substrate.
12. The process according to claim 2 , further wherein the step of applying the energy input and driving-in the cleaved dopant forms an opening through the functional layer at each of the at least one section of the functional layer.
13. The process according to claim 3 , further wherein the step of applying the energy input and driving-in the cleaved dopant forms an opening through the functional layer at each of the at least one section of the functional layer.