IP Library Granted Patent US 8,698,131
Granted Patent B2
US 8,698,131 · App. 12/730,796 · Granted Apr 15, 2014

Organic EL apparatus, method of manufacturing organic EL apparatus, electronic apparatus

Inventor: Kozo Gyoda (Chino, JP)
Assignee: Seiko Epson Corporation
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Quick Facts
Patent No.
US 8,698,131
App. No.
12/730,796
Granted
Apr 15, 2014
Kind
B2
Abstract

Provided is an organic EL apparatus including: an organic EL panel including organic EL devices; a heat releasing member; and a pair of film sheets of which at least one is transparent, wherein the organic EL panel and the heat releasing member overlap and are interposed and encapsulated by the pair of film sheets in a state where a portion of the heat releasing member is exposed outside the pair of film sheets.

Claims (27)

1. An organic EL apparatus comprising:

a first substrate that has a first surface and a second surface being opposite to the first surface;

a second substrate that is opposite to the first surface of the first substrate;

a light emitting element that is disposed between the first surface of the first substrate and the second substrate, the light emitting element having a first electrode, a second electrode, and a light emitting layer disposed between the first electrode and the second electrode;

a heat releasing member having a thermal conductivity and including at least one of graphite or a metal; and

a pair of film sheets,

the heating releasing member having a first portion being in contact with the second surface of the first substrate and a second portion not being in contact with the first substrate,

the first portion of the heat releasing member overlapping the light emitting element in plan view,

the second portion of the heat releasing member being disposed outside of the first and second substrate in plan view,

the first substrate, the second substrate, and the first portion of the heat releasing member being interposed and sealed between the pair of film sheets, and

the second portion of the heat releasing member being exposed outside the pair of film sheets.

2. The organic EL apparatus according to claim 1 ,

wherein the heat releasing member is a lamination structure constituted by a heat releasing sheet, of which thermal conductivity in the in-plane direction is higher than that in the thickness direction thereof, and a heat releasing plate that is made of the metal,

wherein the first substrate and the second substrate overlap the heat releasing sheet, and

wherein a portion of the heat releasing plate is exposed outside the pair of film sheets.

3. The organic EL apparatus according to claim 1 , wherein at least interstices generated between the pair of film sheets and outer circumferential portion end surfaces of the first and second substrate are filled with a sealing resin, and the first and second substrate are encapsulated by the pair of film sheets.

4. The organic EL apparatus according to claim 3 ,

wherein the first substrate is composed of a glass substrate, and

wherein a thickness of the first substrate is equal to or larger than 20 μm and equal to or smaller than 50 μm.

5. The organic EL apparatus according to claim 2 , wherein the heat releasing sheet includes a graphite sheet.

6. The organic EL apparatus according to claim 1 ,

wherein a display panel is further disposed at a side of the heat releasing member opposite to a side where the heat releasing member and the first and second substrate overlap, and

wherein the first and second substrate, the heat releasing member, and the display panel are interposed and encapsulated by the pair of film sheets.

7. The organic EL apparatus according to claim 6 , wherein the display panel is an organic EL panel or an electrophoretic panel having an electrophoretic layer.

8. An electronic apparatus having the organic EL apparatus according to claim 1 .

9. The organic EL apparatus according to claim 1 , wherein the second portion of the heat releasing member is exposed outside peripheries of the pair of film sheets.

10. The organic EL apparatus according to claim 4 , wherein the thickness of the first substrate is equal to or larger than 20 μm and equal to or smaller than 40 μm.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2024
From: SEIKO EPSON CORPORATION
To: LUMITEK DISPLAY TECHNOLOGY LIMITED
Reel/Frame 067131/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2010
From: GYODA, KOZO
To: SEIKO EPSON CORPORATION
Reel/Frame 024135/0589 →
Priority Claims (2)
JP 2009-077571 · Mar 26, 2009 · national
JP 2009-267189 · Nov 25, 2009 · national
Continuity (1)
Related Publication 20100244005A1 · Sep 30, 2010