Semiconductor device
View Patent ↗In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate. In the semiconductor device, a copper plating layer is used for the antenna, an alloy of Ag, Pd, and Cu is used for a seed layer thereof, and TiN or Ti is used for a barrier layer.
1. A semiconductor device comprising:
an antenna; and
an integrated circuit electrically connected to the antenna, the integrated circuit comprising a semiconductor element,
wherein the antenna comprises:
a first layer including titanium nitride;
a second layer over and in contact with the first layer, the second layer including an alloy, wherein the alloy comprises silver, copper, and palladium; and
a third layer over and in contact with the second layer, the third layer including copper.
2. The semiconductor device according to claim 1 , wherein a lower wiring is provided under the first layer.
3. The semiconductor device according to claim 1 , wherein the first layer and the second layer are formed by a sputtering method.
4. The semiconductor device according to claim 1 , wherein a planar shape of the antenna has a rectangular and spiral shape.
5. The semiconductor device according to claim 1 ,
wherein the antenna and the integrated circuit are formed over a substrate, and
wherein the substrate over which the antenna and the integrated circuit are formed is one of a glass substrate and a plastic substrate.
6. The semiconductor device according to claim 1 , further comprising a substrate under the antenna and the integrated circuit,
wherein the integrated circuit comprises a thin film transistor.
7. The semiconductor device according to claim 1 ,
wherein the first layer is a barrier layer,
wherein the second layer is a seed layer, and
wherein the third layer is a copper plating layer.
8. A semiconductor device comprising:
an antenna; and
an integrated circuit electrically connected to the antenna, the integrated circuit comprising a semiconductor element,
wherein the antenna comprises:
a first layer including titanium;
a second layer over and in contact with the first layer, the second layer including an alloy, wherein the alloy comprises silver, copper, and palladium; and
a third layer over and in contact with the second layer, the third layer including copper.
9. The semiconductor device according to claim 8 , wherein a lower wiring is provided under the first layer.
10. The semiconductor device according to claim 8 , wherein the first layer and the second layer are formed by a sputtering method.
11. The semiconductor device according to claim 8 , wherein a planar shape of the antenna has a rectangular and spiral shape.
12. The semiconductor device according to claim 8 ,
wherein the antenna and the integrated circuit are formed over a substrate, and
wherein the substrate over which the antenna and the integrated circuit are formed is one of a glass substrate and a plastic substrate.
13. The semiconductor device according to claim 8 , further comprising a substrate under the antenna and the integrated circuit,
wherein the integrated circuit comprises a thin film transistor.
14. The semiconductor device according to claim 8 ,
wherein the first layer is a barrier layer,
wherein the second layer is a seed layer, and
wherein the third layer is a copper plating layer.
15. A semiconductor device comprising:
a transistor;
a wiring over the transistor, the wiring being electrically connected to the transistor;
an insulating layer over the wiring; and
an antenna over the insulating layer, the antenna being electrically connected to the wiring;
wherein the antenna comprises:
a first layer including titanium nitride;
a second layer over and in contact with the first layer, the second layer including an alloy, wherein the alloy comprises silver, copper, and palladium; and
a third layer over and in contact with the second layer, the third layer including copper.
16. The semiconductor device according to claim 15 , wherein the wiring is provided under the first layer.
17. The semiconductor device according to claim 15 , wherein the first layer and the second layer are formed by a sputtering method.
18. The semiconductor device according to claim 15 , wherein a planar shape of the antenna has a rectangular and spiral shape.
19. The semiconductor device according to claim 15 ,
wherein the transistor is formed over a substrate, and
wherein the substrate is one of a glass substrate and a plastic substrate.
20. The semiconductor device according to claim 15 , wherein the wiring is in contact with the first layer at a contact hole of the insulating layer.
21. The semiconductor device according to claim 15 ,
wherein the transistor is formed over a substrate, and
wherein the substrate is attached to the transistor with an adhesive interposed therebetween.
22. The semiconductor device according to claim 15 , wherein the wiring is a aluminum film having 99.9% purity.
23. The semiconductor device according to claim 15 , wherein the insulating layer includes soft magnetic material.
24. The semiconductor device according to claim 15 , further comprising a silicon nitride film including hydrogen over the transistor.
25. The semiconductor device according to claim 15 , wherein the wiring includes a five layer structure of a titanium layer, a titanium nitride layer, an alloy layer of aluminum and silicon, a titanium layer, and a titanium nitride layer.
26. The semiconductor device according to claim 15 , further comprising a substrate under the transistor,
wherein the transistor is a thin film transistor.
27. The semiconductor device according to claim 15 ,
wherein the first layer is a barrier layer,
wherein the second layer is a seed layer, and
wherein the third layer is a copper plating layer.
28. A semiconductor device comprising:
a transistor;
a wiring over the transistor, the wiring being electrically connected to the transistor;
an insulating layer over the wiring; and
an antenna over the insulating layer, the antenna being electrically connected to the wiring;
wherein the antenna comprises:
a first layer including titanium;
a second layer over and in contact with the first layer, the second layer including an alloy, wherein the alloy comprises silver, copper, and palladium; and
a third layer over and in contact with the second layer, the third layer including copper.
29. The semiconductor device according to claim 28 , wherein the wiring is provided under the first layer.
30. The semiconductor device according to claim 28 , wherein the first layer and the second layer are formed by a sputtering method.
31. The semiconductor device according to claim 28 , wherein a planar shape of the antenna has a rectangular and spiral shape.
32. The semiconductor device according to claim 28 ,
wherein the transistor is formed over a substrate, and
wherein the substrate is one of a glass substrate and a plastic substrate.
33. The semiconductor device according to claim 28 , further comprising a substrate under the transistor,
wherein the transistor is a thin film transistor.
34. The semiconductor device according to claim 28 ,
wherein the first layer is a barrier layer,
wherein the second layer is a seed layer, and
wherein the third layer is a copper plating layer.