Laser processing method
An element-group formation substrate ( 20 ) having plural semiconductor light emitting elements ( 21 ) formed on a substrate front surface ( 11 a ) is sequentially irradiated with a laser beam ( 64 ) having a first output from a substrate back surface ( 11 b ) side in the y direction, and the laser beam ( 64 ) is sequentially collected to a part having a first depth D 1 from the substrate back surface ( 11 b ), thereby forming a first modified region L 1 . The substrate ( 20 ) having the first modified region L 1 formed therein is sequentially irradiated with the laser beam ( 64 ) having a third output (<the first output) from the substrate back surface 11 b side in the y direction, and the laser beam ( 64 ) is sequentially collected to a part having a third depth D 3 from the substrate back surface ( 11 b ) shallower than the first depth D 1 , thereby forming a third modified region L 3.
1. A method for laser processing, comprising the steps of:
forming a front-side modified region inside of an element-group formation substrate having a plurality of electronic elements formed on a front surface of a plate-shaped substrate in one direction along a surface of the substrate by
irradiating the element-group formation substrate sequentially with a laser beam having a predetermined output from a back surface side of the substrate in the one direction, and
collecting the laser beam sequentially to a part inside of the substrate which part has a predetermined depth from the back surface; and
forming a back-side modified region inside of the substrate along the front-side modified region by
irradiating the element-group formation substrate sequentially with a laser beam having one other output smaller than the predetermined output from the back surface side of the substrate in the one direction along the surface of the substrate, the element-group formation substrate having the front-side modified region formed therein, and
collecting the laser beam sequentially to a part inside of the substrate which part has one other depth from the back surface shallower than the predetermined depth.
2. The method for laser processing according to claim 1 , wherein the step of forming the back-side modified region includes irradiating with the laser beam having the one other output so as to face the front-side modified region formed in the substrate.
3. The method for laser processing according to claim 2 , wherein
the step of forming the front-side modified region includes forming the front-side modified region composed by aligning a plurality of front-side modified portions by
collecting the laser beam which is pulse-oscillating inside of the substrate, to form each of the front-side modified portions at a part having the predetermined depth, and
moving an irradiation position of the laser beam on the substrate along the surface of the substrate, and
the step of forming the back-side modified region includes forming the back-side modified region composed by aligning a plurality of back-side modified portions by
collecting the laser beam which is pulse-oscillating inside of the substrate, to form each of the back-side modified portions at a part having the one other depth, and
moving an irradiation position of the laser beam on the substrate along the surface of the substrate, wherein
an interval between two of the back-side modified portions adjacent in the back-side modified region is made narrower than an interval between two of the front-side modified portions adjacent in the front-side modified region.
4. The method for laser processing according to claim 3 , wherein the predetermined depth at which the front-side modified region is formed is set to be less than a half of a thickness of the substrate from the front surface to the back surface thereof in the step of forming the front-side modified region.
5. The method for laser processing according to claim 2 , wherein the predetermined depth at which the front-side modified region is formed is set to be less than a half of a thickness of the substrate from the front surface to the back surface thereof in the step of forming the front-side modified region.
6. The method for laser processing according to claim 1 , wherein
the step of forming the front-side modified region includes forming the front-side modified region composed by aligning a plurality of front-side modified portions by
collecting the laser beam which is pulse-oscillating inside of the substrate, to form each of the front-side modified portions at a part having the predetermined depth, and
moving an irradiation position of the laser beam on the substrate along the surface of the substrate, and
the step of forming the back-side modified region includes forming the back-side modified region composed by aligning a plurality of back-side modified portions by
collecting the laser beam which is pulse-oscillating inside of the substrate, to form each of the back-side modified portions at a part having the one other depth, and
moving an irradiation position of the laser beam on the substrate along the surface of the substrate, wherein
an interval between two of the back-side modified portions adjacent in the back-side modified region is made narrower than an interval between two of the front-side modified portions adjacent in the front-side modified region.
7. The method for laser processing according to claim 6 , wherein the predetermined depth at which the front-side modified region is formed is set to be less than a half of a thickness of the substrate from the front surface to the back surface thereof in the step of forming the front-side modified region.
8. The method for laser processing according to claim 1 , wherein the predetermined depth at which the front-side modified region is formed is set to be less than a half of a thickness of the substrate from the front surface to the back surface thereof in the step of forming the front-side modified region.
9. A method for laser processing to form, inside of an element-group formation substrate having a plurality of electronic elements formed on a front surface of a plate-shaped substrate, a plurality of modified regions extending in one direction along a surface of the substrate by irradiating the element-group formation substrate with a laser beam from a back surface side of the substrate, the method comprising the step of
forming the plurality of modified regions in the order from a side of the substrate close to the front surface toward a side thereof far from the front surface, while reducing an output of the laser beam at the time of forming each of the modified regions in the order from the side of the substrate close to the front surface toward the side thereof far from the front surface.
10. The method for laser processing according to claim 9 , wherein the plurality of modified regions are formed so as to overlap with each other in a thickness direction of the substrate.
11. The method for laser processing according to claim 10 , wherein
each of the plurality of modified regions is formed by moving the laser beam which is pulse-oscillating in the one direction, and
moving the laser beam which is pulse-oscillating in the one direction provides each of the plurality of modified regions composed of a plurality of modified portions aligning in the one direction, while intervals between adjacent ones of the modified portions in the one direction in each of the plurality of modified regions are narrowed as a distance from the front surface of the substrate increases.
12. The method for laser processing according to claim 11 , wherein the plurality of modified regions are formed so as to be closer to the back surface of the substrate than a center in the thickness direction from the front surface of the substrate to the back surface thereof.
13. The method for laser processing according to claim 12 , wherein
the substrate is formed of sapphire, and
each of the plurality of electronic elements includes a group III nitride semiconductor layer.
14. The method for laser processing according to claim 10 , wherein the plurality of modified regions are formed so as to be closer to the back surface of the substrate than a center in the thickness direction from the front surface of the substrate to the back surface thereof.
15. The method for laser processing according to claim 10 , wherein
the substrate is formed of sapphire, and
each of the plurality of electronic elements includes a group III nitride semiconductor layer.
16. The method for laser processing according to claim 9 , wherein
each of the plurality of modified regions is formed by moving the laser beam which is pulse-oscillating in the one direction, and
moving the laser beam which is pulse-oscillating in the one direction provides each of the plurality of modified regions composed of a plurality of modified portions aligning in the one direction, while intervals between adjacent ones of the modified portions in the one direction in each of the plurality of modified regions are narrowed as a distance from the front surface of the substrate increases.
17. The method for laser processing according to claim 16 , wherein the plurality of modified regions are formed so as to be closer to the back surface of the substrate than a center in the thickness direction from the front surface of the substrate to the back surface thereof.
18. The method for laser processing according to claim 16 , wherein
the substrate is formed of sapphire, and
each of the plurality of electronic elements includes a group III nitride semiconductor layer.
19. The method for laser processing according to claim 9 , wherein the plurality of modified regions are formed so as to be closer to the back surface of the substrate than a center in the thickness direction from the front surface of the substrate to the back surface thereof.
20. The method for laser processing according to claim 9 , wherein
the substrate is formed of sapphire, and
each of the plurality of electronic elements includes a group III nitride semiconductor layer.