Semiconductor test structures

1. A resistive test structure comprising:

a semiconductor substrate with an active region;

a gate stack formed over the active region;

a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack; and

a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.

2. The resistive test structure of claim 1 , wherein the gate stack includes a gate electrode that does not extend along an entirety of the active region in the second dimension.

3. The resistive test structure of claim 1 , wherein the gate stack is configured in at least one of the following arrangements:

grounded at one or both of the first and second electrical contacts;

voltage biased at one or both of the first and second electrical contacts; and

one or both of the first and second electrical contacts are floating.

4. The resistive test structure of claim 1 , wherein the gate stack omits sidewalls.

5. The resistive test structure of claim 1 , wherein the gate stack includes a gate electrode, further wherein the gate electrode includes one or more shapes formed therein.

6. The resistive test structure of claim 1 , wherein the active region includes a uniform doping profile.

7. The resistive test structure of claim 1 , wherein the active region includes a heavily doped region and a light-doped region.

8. The resistive test structure of claim 1 , wherein each of the first and second electrical contacts includes a pair of metal plugs on each of the opposing sides with a shorting member coupling the pair of metal plugs.

9. The resistive test structure of claim 1 , formed in one of the following locations:

a dummy wafer;

a scribe line of a production wafer; and

a circuit region of a production wafer.

10. A semiconductor device comprising:

a Metal Oxide Semiconductor (MOS) structure having:

a semiconductor substrate with an active region and a gate stack disposed on the active region;

a first pair of electrical contacts on opposing side of the gate stack in communication with the active region, the first pair of electrical contacts being electrically connected across a first dimension of the gate stack; and

a second pair of electrical contacts on the opposing side of the gate stack in communication with the active region, the second pair of electrical contacts being electrically connected across the first dimension of the gate stack, the first and second pairs of electrical contacts spaced along a longest dimension of the gate stack perpendicular to the first dimension.

11. The semiconductor device claim 10 , wherein the gate stack includes a gate electrode that comprises at least one of the following materials:

polysilicon; and

a gate metal.

12. The semiconductor device claim 10 , wherein the gate stack includes a gate dielectric that comprises at least one of:

a high-k dielectric layer with an oxide interfacial layer; and

SiO2.

13. The semiconductor device claim 10 , formed in one of the following locations:

a dummy wafer;

a scribe line of a production wafer; and

a circuit region of a production wafer.