IP Library Granted Patent US 8,705,777
Granted Patent B2
US 8,705,777 · App. 13/601,896 · Granted Apr 22, 2014

MEMS microphone and method of manufacturing the same

Inventors: Chang Han Je (Daejeon, KR); Jae Woo Lee (Daejeon, KR); Woo Seok Yang (Daejeon, KR); Jong Dae Kim (Daejeon, KR)
Assignee: Electronics and Telecommunications Research Institute
H04R1/00H04R31/00
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Quick Facts
Patent No.
US 8,705,777
App. No.
13/601,896
Granted
Apr 22, 2014
Kind
B2
Abstract

Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.

Claims (23)

1. A MEMS microphone comprising:

a substrate;

a rear acoustic chamber formed inside a front surface of the substrate;

a vibrating plate formed on the substrate and having an exhaust hole;

a fixed electrode formed on the vibrating plate; and

a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.

2. The MEMS microphone of claim 1 , wherein the vibrating plate is formed at the same height as an upper surface of the substrate or is formed to be spaced apart from the substrate at a predetermined interval.

3. The MEMS microphone of claim 1 , wherein the vibrating plate is connected to the substrate by using a vibrating plate/substrate connector formed at an outer periphery thereof.

4. The MEMS microphone of claim 1 , wherein the fixed electrode is formed to be spaced part from the vibrating plate at a predetermined interval.

5. The MEMS microphone of claim 1 , wherein the fixed electrode is connected to the substrate by using a fixed electrode/substrate connector formed at an outer periphery thereof.

6. The MEMS microphone of claim 1 , wherein a diameter of the exhaust hole is larger than a diameter of a cross-section of the fixed electrode support.

7. The MEMS microphone of claim 1 , wherein etching preventing walls are formed on an outer wall of the fixed electrode support and an inner wall of the rear acoustic chamber.

8. The MEMS microphone of claim 7 , wherein the etching preventing wall is any one of an oxide film, a nitride film and a metal.

9. The MEMS microphone of claim 1 , wherein the fixed electrode includes a metal and an insulation film.

10. A MEMS microphone comprising:

a substrate;

a rear acoustic chamber formed inside a front surface of the substrate;

a vibrating plate formed on the substrate and having a plurality of exhaust holes;

a fixed electrode formed on the vibrating plate; and

a plurality of fixed electrode supports supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the plurality of exhaust holes.

11. The MEMS microphone of claim 10 , wherein diameters of the exhaust holes are larger than diameters of cross-sections of the fixed electrode supports.

12. The MEMS microphone of claim 10 , wherein etching preventing walls are formed on outer walls of the fixed electrode supports and an inner wall of the rear acoustic chamber.

13. The MEMS microphone of claim 12 , wherein the etching preventing wall is any one of an oxide film, a nitride film and a metal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2012
From: JE, CHANG HAN; LEE, JAEWOO; YANG, WOO SEOK; KIM, JONGDAE
To: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Reel/Frame 028909/0475 →
Priority Claims (1)
KR 10-2011-0104107 · Oct 12, 2011 · national
Continuity (1)
Related Publication 20130094675A1 · Apr 18, 2013