Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same
There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame.
1. A case of an electronic device having an antenna pattern embedded therein, the case comprising:
a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface of the radiator frame;
a case frame injection molded upward of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and
a boundary part configured to form a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame, wherein
the groove has an inclination.
2. The case of claim 1 , wherein
the radiator frame includes a through hole, and
the antenna pattern part includes a loop antenna wound around an outer portion of the through hole.
3. The case of claim 2 , wherein the through hole is inserted into an inner boundary jaw of a mold of the case through which the case frame is injection molded.
4. The case of claim 2 , wherein the case frame and the through hole are provided with a through hole boundary groove formed at a boundary therebetween.
5. The case of claim 4 , wherein the through hole boundary groove has an inclination, a depth of which becomes shallower in a direction from the through hole toward the case frame formed at an inner portion of the through hole.
6. The case of claim 1 , wherein the case frame formed at an outer portion of the radiator frame and the radiator frame are provided with an outer boundary groove formed at a boundary therebetween.
7. The case of claim 6 , wherein the outer boundary groove has an inclination, a depth of which becomes shallower in a direction from the radiator frame toward the case frame formed at an outer portion of the radiator frame.
8. The case of claim 1 , wherein
the radiator includes a connection terminal part on one surface of the radiator frame, and
the connection terminal part is injection molded to be exposed on a connection terminal support formed to protrude to an outer portion of the radiator frame.
9. The case of claim 8 , wherein the connection terminal support includes an interconnection hole formed in a position corresponding to that of the connection terminal part.
10. The case of claim 1 , wherein the radiator frame includes an outer jaw disposed to be higher than an uppermost portion of the radiator.
11. A mold for manufacturing a case of an electronic device, the mold comprising:
upper and lower molds contacted with and supported by an radiator frame, the radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface of the radiator frame;
a resin material inlet formed on at least one of the upper mold or the lower mold and having a resin material introduced thereinto so that a case frame shaped inner space formed by combining the upper and lower molds becomes a case frame; and
a boundary part forming part provided to at least one of the upper mold or the lower mold and having the radiator frame inserted thereinto, wherein
the boundary part forming part has an increasing inclination in a direction in which the resin material moves in the inner space.
12. The mold of claim 11 , wherein the boundary part forming part includes a protrusion protruding from the upper mold or the lower mold so that an outer circumferential portion defining an outer boundary of the radiator frame and an inner circumferential portion of a through hole formed in the radiator frame are inserted thereinto.
13. The mold of claim 11 , wherein the inclination is formed such that the introduced resin material first contacts an upper surface of the radiator frame.
14. The mold of claim 11 , wherein the boundary part forming part has a large height at a boundary part of the radiator frame and a reduced height toward the inner space.
15. The mold of claim 11 , wherein the resin material inlet is formed at an outer portion of the boundary part forming part.
16. The mold of claim 11 , wherein the boundary part forming part includes an inclination part guiding the resin material to be inclined upwardly or downwardly within the case frame shaped inner space and a flat part continuously extended from the inclination part and guiding the resin material horizontally.
17. The mold of claim 16 , wherein the inclination part has a tangential gradient of a bottom surface increased in a moving direction of an injection molding liquid.
18. The mold of claim 16 , wherein a height of the flat part corresponds to a height of the radiator frame.
19. The mold of claim 11 , wherein the boundary part forming part includes the inclination part guiding the resin material to be inclined upwardly or downwardly within the case frame shaped inner space and having a tangential gradient of a bottom surface increasing in a moving direction of the injection molding liquid.
20. The mold of claim 19 , wherein a height of the inclination part corresponds to that of the radiator frame.
21. The mold of claim 11 , wherein the boundary part forming part includes the inclination part guiding the resin material to be inclined upwardly or downwardly within the case frame shaped inner space and having a tangential gradient of a bottom surface increasing and then decreasing at any one point thereof.
22. The mold of claim 21 , wherein a height of the inclination part corresponds to that of the radiator frame.
23. A method of manufacturing a case of an electronic device, the method comprising:
forming a radiator including an antenna pattern part by pressing a metal sheet;
injection molding a radiator frame to embed and expose the antenna pattern part in and on one surface of the radiator frame;
allowing an outer circumferential surface of the radiator frame to be inserted into and seated in an inner side of a boundary part forming part formed in a mold of the case of the electronic device; and
allowing a resin material to be introduced from an outer side of the boundary part forming part, pass through the boundary part forming part having an increasing inclination in a direction in which the resin material moves in the inner space, be introduced from an upper surface of the radiator frame and be then filled in a case frame shaped inner space formed in the mold of the case of the electronic device.
24. The method of claim 23 , wherein the radiator frame is molded so that a through hole is formed at an inner side of the antenna pattern part, and
the radiator frame is seated in the mold of the case of the electronic device including the boundary part forming part into which the through hole is inserted.