Laser soldering using thermal characteristics
In this soldering method, a laser is directed onto an end face of the stack in such a manner that the laser heats the stack. At least one parameter of the laser is adjusted to a value that is the image by a mathematical model of at least one thermal characteristic of the stack. The parameter of the laser is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiating power of the laser.
1. A soldering method comprising:
soldering together, in a single soldering step, at least three stacked elements forming a stack, in which a laser is directed onto an end face of the stack so that the laser heats the stack, and at least one parameter of the laser is adjusted, wherein:
the stack comprises:
a support,
a first chip,
a second chip,
a first solder-forming mass, and
a second solder-forming mass, the first solder-forming mass and the second solder-forming mass being interposed between the support and the first chip and between the first chip and the second chip, respectively,
the parameter is adjusted to a value to take account of at least one thermal characteristic of the stack by using a mathematical model, and
the thermal characteristic of the stack is selected from one of: a critical temperature for damaging an element of the stack, a melting temperature of one of the first solder-forming mass and the second solder-forming mass interposed between two elements of the stack, and a temperature of a synthetic material bordering one of the elements of the stack; and
preparing a mathematical model for implementation of the soldering method in compliance with an experimental design.
2. A soldering method according to claim 1 , in which the laser parameter is a parameter selected from an irradiation duration, a surface area of the end face of the stack that is irradiated by the laser, and an irradiation power of the laser.
3. A soldering method according to claim 1 , in which the thermal characteristic of the stack is selected from a critical temperature for damaging an element of the stack, a melting temperature of a solder-forming mass interposed between two elements of the stack, and a temperature of a synthetic material bordering one of the elements of the stack.
4. A soldering method according to claim 1 , wherein the step of preparing the mathematical model for implementation further comprises the following steps, in compliance with the experimental design:
adjusting the value of the parameter of the laser;
measuring temperatures over a zone of at least one sample of at least a portion of the stack during a duration in which a first end face of the sample is irradiated by the laser; and
selecting at least one maximum temperature from the measured temperatures; and also including a step of defining a mathematical model in such a manner that a vector having the value of the laser parameter as a coordinate is the image as obtained by means of the mathematical model of a vector having at least the maximum temperature as a coordinate.
5. A soldering method according to claim 4 , in which the mathematical model includes at least one mathematical function that comprises a polynomial.
6. A soldering method according to claim 4 , in which, prior to the step of measuring temperatures, the zone of the sample is blackened.
7. A soldering method according to claim 4 , in which the temperatures are measured by processing an infrared image of the zone of the sample.
8. A soldering method according to claim 4 , in which the experimental design is a design selected from one of a Box Behnken design; a composite central design; and a D-optimal design.
9. A soldering method according to claim 4 , in which the mathematical model is determined from a method of analyzing the variance of the at least one maximum temperature.
10. A soldering method according to claim 4 , in which the zone extends over a second end face of the sample and the at least one maximum temperature is a maximum temperature measured in a sub-zone of the zone.
11. A soldering method according to claim 10 , in which the sub-zone separates a portion of the zone that is to be covered in a solder-forming mass from another portion of the zone that is not to be covered by the solder-forming mass.
12. A soldering method according to claim 10 , in which the sub-zone is the laser-irradiated surface area as projected onto the second end face of the sample.
13. A soldering method according to claim 10 , in which an element of the sample comprises a metal portion bordered by a portion made of synthetic material, and the sub-zone separates the metal portion from the portion made of synthetic material.