IP Library › Granted Patent US 8,723,167
Granted Patent B2
US 8,723,167 · App. 13/484,399 · Granted May 13, 2014

Reflecting material and light emitting diode device

Inventors: Satoshi Sato (Osaka, JP); Hisataka Ito (Osaka, JP); Yasunari Ooyabu (Osaka, JP); Yuki Shinbori (Osaka, JP)
Assignee: Nitto Denko Corporation
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Quick Facts
Patent No.
US 8,723,167
App. No.
13/484,399
Granted
May 13, 2014
Kind
B2
Abstract

A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.

Claims (24)

1. A reflecting material comprising:

a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and

a light reflecting component.

2. The reflecting material according to claim 1 , wherein

the light reflecting component is a white pigment.

3. The reflecting material according to claim 1 , wherein

the light reflecting component is a titanium oxide.

4. The reflecting material according to claim 1 , wherein

the light reflecting component is a titanium oxide having a rutile type crystal structure.

5. The reflecting material according to claim 1 , wherein

the reflecting material further comprises an inorganic filler.

6. The reflecting material according to claim 1 , wherein

the silicone resin composition is in a semi-cured state.

7. The reflecting material according to claim 6 , wherein

the reflecting material is formed into a sheet state.

8. A light emitting diode device comprising:

a board,

a light emitting diode element provided on the board, and

a reflector provided on the board so as to surround the light emitting diode element and formed of a reflecting material, wherein

the reflecting material comprising:

a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and

a light reflecting component.

9. The light emitting diode device according to claim 8 , wherein

the reflector is provided so as to be in close contact with a side surface of the light emitting diode element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2012
From: SATO, SATOSHI; ITO, HISATAKA; OOYABU, YASUNARI; SHINBORI, YUKI
To: NITTO DENKO CORPORATION
Reel/Frame 028297/0623 →
Priority Claims (1)
JP 2011-123217 · Jun 1, 2011 · national
Continuity (1)
Related Publication 20120305969A1 · Dec 6, 2012