Semiconductor package and system
A semiconductor package includes a package board, a pellet provided over the package board, and a protection member covering the package board and the pellet and including a hole penetrating the protection member.
1. A semiconductor package comprising:
a package board;
a pellet provided over the package board; and
a protection member covering the package board and the pellet and including a hole penetrating the protection member.
2. The semiconductor package according to claim 1 , wherein the package board includes another hole penetrating the package board.
3. The semiconductor package according to claim 2 , wherein the package board includes a coil.
4. The semiconductor package according to claim 3 , wherein the pellet includes a circuit receiving power supplied from the coil.
5. The semiconductor package according to claim 3 wherein the second hole is surrounded by the coil.
6. The semiconductor package according to claim 4 , further comprising an antenna coupled to the circuit.
7. The semiconductor package according to claim 3 , wherein the coil includes a wiring extended in a wiring layer formed between an upper surface of the package board and a lower surface of the package board.
8. The semiconductor package according to claim 4 , further comprising a pad coupled to the coil and the circuit.