Semiconductor device having a plurality of fins with different heights and method for manufacturing the same
The present disclosure provides a semiconductor device and a method for manufacturing the same. The semiconductor device comprises: a semiconductor layer comprising a plurality of semiconductor sub-layers; and a plurality of fins formed in the semiconductor layer and adjoining the semiconductor layer, wherein at least two of the plurality of fins comprise different numbers of the semiconductor sub-layers and have different heights. According to the present disclosure, a plurality of semiconductor devices with different dimensions and different driving abilities can be integrated on a single wafer.
1. A semiconductor device, comprising:
a semiconductor layer comprising a plurality of semiconductor sub-layers; and
a plurality of fins formed in the semiconductor layer and adjoining the semiconductor layer,
wherein at least two of the plurality of fins comprise different number of the semiconductor sub-layers and have different heights.
2. The semiconductor device according to claim 1 , wherein adjacent semiconductor sub-layers of the plurality of semiconductor sub-layers are made of different materials, such that the adjacent semiconductor sub-layers have etching selectivities with respect to each other.
3. The semiconductor device according to claim 1 , further comprising gate stacks being formed astride respective ones of the plurality of fins.
4. The semiconductor device according to claim 2 , wherein the semiconductor layer comprises alternately stacked fin-body material sub-layers and etching-stop sub-layers, wherein thicknesses of the fin-body material sub-layers are larger than those of the etching-stop sub-layers.
5. The semiconductor device according to claim 4 , wherein the fin-body material sub-layers comprise Si, and the etching-stop sub-layers comprise SiGe.
6. The semiconductor device according to claim 3 , wherein the gate stacks are isolated from the semiconductor layer by an isolation layer.