Microelectronic devices and methods for manufacturing microelectronic devices
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate.
1. A plurality of microelectronic devices, comprising:
a rigid substrate having a plurality of holes arranged in arrays and a plurality of conductive traces, the substrate having a first side and a second side opposite from the first side;
a first conductive material having a first surface facing the first side of the substrate, and a second surface facing away from the first surface;
a second conductive material having a first face and a second face facing away from the first face, the first face directly containing the second surface of the first material, and the second conductive material at least partially conforming to the individual holes;
a plurality of electrical couplers directly contacting corresponding traces at the first side of the substrate; and
a plurality of singulated microelectronic dies at the second side of the substrate, the individual dies including an active side facing toward the substrate, a plurality of terminals disposed on the active side and aligned with corresponding holes, a back side opposite the active side, and a plurality of ends extending between the active side and the back side, wherein the second conductive material directly contacts the individual terminals.
2. The microelectronic devices of claim 1 wherein the substrate comprises a partially cured substrate.
3. The microelectronic devices of claim 1 wherein the substrate comprises a preformed substrate.
4. The microelectronic devices of claim 2 wherein the partially cured substrate comprises a substrate having preformed through-holes.
5. The microelectronic devices of claim 1 wherein:
the substrate comprises a dielectric substrate; and
the microelectronic devices further comprise an adhesive layer coupling the dies to the dielectric substrate.
6. The microelectronic devices of claim 1 wherein the individual dies are attached to the substrate without an adhesive positioned between the dies and the substrate.
7. The microelectronic devices of claim 1 wherein the substrate comprises a pre-preg material.
8. The microelectronic devices of claim 1 , further comprising solder mask at the first side of the substrate.
9. The microelectronic devices of claim 8 wherein the solder mask contacts the conductive links at the first side of the substrate.
10. The microelectronic devices of claim 1 , further comprising an encapsulant between adjacent dies, the encapsulant encasing at least a portion of the ends of the dies.
11. A plurality of microelectronic devices, comprising:
a rigid substrate having a plurality of preformed holes arranged in arrays and a plurality of conductive traces, the substrate having a first side and a second side opposite from the first side;
a first conductive material having a first surface facing the first side of the substrate, and a second surface facing away from the first surface;
a second conductive material having a first face and a second face facing away from the first face, the first face directly containing the second surface of the first material, and the second conductive material at least partially conforming to the individual holes;
an electrical coupler directly contacting the trace at the first side of the substrate;
a solder mask covering the plurality of conductive links at the first side of the substrate;
a plurality of singulated microelectronic dies at the second side of the substrate, the individual dies including an active side facing toward the substrate, a plurality of terminals disposed on the active side and aligned with corresponding holes, a back side opposite the active side, and a plurality of ends extending between the active side and the back side, wherein the second conductive material directly contacts the individual terminals; and
an encapsulant between adjacent dies, the encapsulant encasing at least a portion of the ends of the dies.
12. A method for manufacturing microelectronic devices, the method comprising:
providing a substrate having a dielectric layer with a first side and a second side facing away from the first side, the substrate having a plurality of traces and a plurality of through holes arranged in arrays;
placing first conductive material at the first side of the substrate;
placing second conductive material in direct contact with the first conductive material and in the through holes to form conductive links, wherein individual conductive links are in direct contact with corresponding traces at the first side of the substrate;
attaching a plurality of microelectronic dies to the substrate with an active side of the individual dies facing toward the second side of the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding through holes in the substrate, wherein the dies are attached to the substrate after forming the through holes in the substrate; and
attaching a plurality of electrical couplers in direct contact with corresponding conductive traces at the first side of the substrate.
13. The method of claim 12 wherein the individual dies further comprise a back side opposite the active side and a plurality of ends extending between the active side and the back side, and wherein the method further comprises:
curing the substrate after attaching the dies to the substrate; and
placing an encapsulant between adjacent dies to encase at least a portion of the ends of the dies.
14. The method of claim 12 wherein providing the substrate comprises forming the through holes in a partially cured substrate.
15. The method of claim 12 wherein providing the substrate comprises forming the through holes in a pre-preg material.
16. The method of claim 12 wherein attaching the microelectronic dies to the substrate comprises coupling singulated dies to the substrate without an adhesive positioned between the substrate and the dies.
17. The method of claim 12 , further comprising curing the substrate after attaching the dies to the substrate.
18. The method of claim 12 , further comprising laser drilling the through holes in the substrate prior to providing the substrate.
19. The method of claim 12 , further comprising punching the through holes in the substrate prior to providing the substrate.
20. The method of claim 12 , further comprising placing a dielectric material at the first side of the substrate over at least one conductive link.