Semiconductor device having a plurality of pads of low diffusible material formed in a substrate
A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.
1. A semiconductor device comprising:
a first semiconductor substrate;
a plurality of first pads formed in the first semiconductor substrate and made of copper;
a second semiconductor substrate; and
a plurality of second pads formed in the second semiconductor substrate, each of the second pads having a surface layer exposed to the second semiconductor substrate, a portion of each second pad other than the surface layer being made of copper, and the surface layer being made of a lower diffusible material than copper,
wherein,
a size of each of the second pads is larger than that of each of the first pads.
2. The semiconductor device of claim 1 , wherein, each of the first pads is positioned to face a respective second pad.
3. The semiconductor device of claim 2 , wherein each first pad has a surface exposed to and facing the second substrate, each second pad has a surface exposed to and facing the first substrate, and the exposed surface of the second pad is larger that the exposed surface of the respective first pad.
4. The semiconductor device of claim 1 , wherein each second pad comprises a base portion and covering layer, the base part and the covering layer being made of different materials, the covering part being made of a relatively low diffusing metal.
5. The semiconductor device of claim 4 , wherein the covering layer surrounds the base portion.
6. The semiconductor device of claim 4 , wherein the covering layer is made of one of Au, Ag, Al, Ta, Ti, W, Sn, Mo, Ni, In, Co, or an alloy of any of them.
7. The semiconductor device of claim 4 , wherein the base portion is made of copper.
8. The semiconductor device of claim 4 , wherein the covering layer extends across an entire surface of the base portion that faces the first substrate.
9. The device of claim 1 , wherein each of the first pads are formed in a recess portion in a first dielectric film in the first substrate.
10. The device of claim 2 , wherein each of the second pads are formed in a recess portion in a second dielectric film in the second substrate.
11. The device of claim 10 , wherein each of the first pads are formed in a recess portion in a first dielectric film in the first substrate and at least a portion of each second pad comes into contact with the first dielectric film.
12. The device of claim 1 , wherein at least a side of each of the second pads is approximately 6 μm or more.
13. The device of claim 1 wherein at least one of the first semiconductor and the semiconductor substrate contains a logic device.
14. The device of claim 13 , wherein the other of the first semiconductor substrate and the semiconductor substrate contains memory.
15. The device of claim 13 , wherein the logic device includes at least one of MPU and peripheral circuit.
16. The device of claim 1 , wherein at least one of the first semiconductor substrate and the semiconductor substrate contains memory.
17. The device of claim 16 , wherein the memory includes at least one of DRAM, SRAM, and flash memory.
18. The device of claim 1 , wherein each of the first pads are formed in a recess portion in a first dielectric film in the first substrate, wherein each of the second pads are formed in a recess portion in a second dielectric film in the second substrate, and wherein a barrier metal is disposed between a portion of each first pad and the first dielectric film.