IP Library › Granted Patent US 8,760,844
Granted Patent B2
US 8,760,844 · App. 13/207,267 · Granted Jun 24, 2014

Devices having a diamond-like-carbon dielectric

Inventors: William G. Baron (Springfield, OH); Jeffrey A. Brogan (Stony Brook, NY); Sandra Fries-Carr (Dayton, OH); Richard J. Gambino (Port Jefferson, NY); Christopher Gouldstone (Huntington, NY); Brian Keyes (Patchogue, NY); Sanjay Sampath (Setauket, NY); Huey-Daw Wu (Stony Brook, NY); Richard L. C. Wu (Beavercreek, OH)
Assignee: Mesoscribe Technologies, Inc.
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Quick Facts
Patent No.
US 8,760,844
App. No.
13/207,267
Granted
Jun 24, 2014
Kind
B2
Abstract

A structural capacitor includes a first carbon fiber material layer, a second carbon fiber material layer, and an interlayer dielectric including a diamond-like-carbon material layer.

Claims (17)

1. A structural capacitor, comprising:

a first carbon fiber material layer;

a substantially flat metal foil layer disposed on top of the first carbon fiber material layer;

a first interlayer dielectric including a diamond-like-carbon material layer laminated on a bottom surface of the metal foil layer, the first interlayer dielectric disposed between the metal foil layer and the first carbon fiber material layer;

a second interlayer dielectric including a diamond-like-carbon material layer laminated on a top surface of the metal foil layer, the second interlayer dielectric disposed between the metal foil layer and a second carbon fiber material layer; and

the second carbon fiber material layer disposed on top of the second interlayer dielectric.

2. The structural capacitor of claim 1 , wherein a first plurality of capacitors is formed between the metal foil layer and the first carbon fiber material layer and a second plurality of capacitors is formed between the metal foil layer and the second carbon fiber material layer.

3. The structural capacitor of claim 1 , further including a first plurality of metal film electrodes disposed between the first interlayer dielectric and the first carbon fiber material layer and a second plurality of metal film electrodes disposed between the second interlayer dielectric and the second carbon fiber material layer.

4. The structural capacitor of claim 3 , wherein the first plurality of metal film electrodes, in association with the metal foil layer and the interlayer dielectric disposed therebetween, comprises a first plurality of capacitors and the second plurality of metal film electrodes, in association with the metal foil layer and the interlayer dielectric disposed therebetween, comprises a second plurality of capacitors.

5. The structural capacitor of claim 4 , further including a first set of electrically conductive lines disposed between the first carbon fiber material layer and the first plurality of metal film electrodes and making electrical contact to each of the first plurality of capacitors and a second set of electrically conductive lines disposed between the second carbon fiber material layer and the second plurality of metal film electrodes and making electrical contact to each of the second plurality of capacitors.

6. The structural capacitor of claim 4 , wherein the first and second set of capacitors together includes at least one functioning capacitor and at least one defective capacitor and the structural capacitor further includes:

a first set of electrically conductive lines disposed between the first carbon fiber material layer and the first plurality of metal film electrodes and making electrical contact to each of the first plurality of capacitors that a functioning capacitor and not making electrical contact to any of the first plurality of capacitors that are defective; and

a second set of electrically conductive lines disposed between the second carbon fiber material layer and the second plurality of metal film electrodes and making electrical contact to each of the second plurality of capacitors that is functioning and not making electrical contact to any of the second plurality of capacitors that is defective.

7. The structural capacitor of claim 5 , wherein each electrically conductive line of the first and second sets of electrically conductive lines includes a fuse that is configured to sever a corresponding connection between a corresponding metal line and a corresponding metal film electrode when it is determined that a corresponding capacitor corresponding to the corresponding metal film electrode is defective.

8. The structural capacitor of claim 3 , wherein all of the first plurality of metal film electrodes are coplanar with respect to each other and all of the second plurality of metal film electrodes are coplanar with respect to each other.

9. The structural capacitor of claim 1 , wherein the first and second carbon fiber material layers are carbon fiber/epoxy prepregs and are not capacitor electrodes for the structural capacitor.

10. The structural capacitor of claim 3 , wherein the only capacitor electrodes of the structural capacitor include the first and second pluralities of metal film electrodes and the metal film layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2018
From: MESOSCRIBE TECHNOLOGIES, INC.
To: CVD MESOSCRIBE TECHNOLOGIES CORPORATION
Reel/Frame 047818/0951 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME INADVERTENTLY SPELLED AS: "MESOCRIBE" TECHNOLOGIES, INC. PREVIOUSLY RECORDED ON REEL 032483 FRAME 0877. ASSIGNOR(S) HEREBY CONFIRMS THE THE CORRECT SPELLING OF ASSIGNEE READS: MESOSCRIBE TECHNOLOGIES, INC.. Recorded Mar 31, 2014
From: BROGAN, JEFFREY A.; GAMBINO, RICHARD J.; WU, HUEY-DAW; GOULDSTONE, CHRISTOPHER; KEYES, BRIAN; SAMPATH, SANJAY
To: MESOSCRIBE TECHNOLOGIES, INC.
Reel/Frame 032577/0963 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2014
From: BROGAN, JEFFREY A.; GAMBINO, RICHARD J.; WU, HUEY-DAW; GOULDSTONE, CHRISTOPHER; KEYES, BRIAN; SAMPATH, SANJAY
To: MESOCRIBE TECHNOLOGIES, INC.
Reel/Frame 032483/0877 →
Continuity (2)
Provisional Application 61373554 · Aug 13, 2010
Related Publication 20120039017A1 · Feb 16, 2012