Radiation sensitive resin composition, method for forming a pattern, polymer and compound
A radiation sensitive resin composition includes a first polymer having a group represented by a following formula (1), and a radiation sensitive acid generator. n is an integer of 2 to 4. X represents a single bond or a bivalent organic group. A represents a (n+1) valent linking group. Each Q independently represents a group that includes an alkali-dissociable group.
1. A radiation sensitive resin composition comprising:
a first polymer having a group represented by a following formula (1); and
a radiation sensitive acid generator,
wherein in the formula (1),
n is an integer of 2 to 4,
X represents a single bond or a bivalent organic group,
A represents an (n+1) valent linking group, and
each Q independently represents a group that includes an alkali-dissociable group and that is represented by a following formula (2-2):
wherein in the formula (2-2),
each of R 6 and R 7 independently represents a hydrogen atom or a chain hydrocarbon group having 1 to 10 carbon atoms, and
R 8 represents a monovalent organic group.
2. The radiation sensitive resin composition according to claim 1 , wherein A in the formula (1) represents an alicyclic group having 4 to 20 carbon atoms, or a chain hydrocarbon group having 1 to 20 carbon atoms.
3. The radiation sensitive resin composition according to claim 1 , wherein a content of structural units having the group represented by the formula (1) with respect to entire structural units that constitute the first polymer is no less than 5 mol %.
4. The radiation sensitive resin composition according to claim 1 , further comprising: a second polymer which is a base polymer and which has an acid-dissociable group.
5. A method for forming a pattern, comprising:
forming a resist film by applying the radiation sensitive resin composition according to claim 1 on a substrate;
exposing at least a part of the resist film by irradiating with a radioactive ray by liquid immersion lithography;
heating the exposed resist film; and
developing the heated resist film.
6. A polymer comprising:
a group represented by a following formula (1):
wherein in the formula (1),
n is an integer of 2 to 4,
X represents a single bond or a bivalent organic group,
A represents an (n+1) valent linking group, and
each Q independently represents a group that includes an alkali-dissociable group and that is represented by a following formula (2-2):
wherein in the formula (2-2),
each of R 6 and R 7 independently represents a hydrogen atom or a chain hydrocarbon group having 1 to 10 carbon atoms, and
R 8 represents a monovalent organic group.
7. The polymer according to claim 6 , wherein A in the formula (1) represents an alicyclic group having 4 to 20 carbon atoms or a chain hydrocarbon group having 1 to 20 carbon atoms.