IP Library Granted Patent US 8,777,828
Granted Patent B2
US 8,777,828 · App. 13/108,450 · Granted Jul 15, 2014

Method and system for creating co-layer surface adhesive rule

Inventors: Michael Zimmer (Moshav Beit-Elazari, IL); Aviv Ratzman (Mazkeret Batia, IL); David Idan (Moshav Emunim, IL); Lior Dahan (Ramat Gan, IL); Kostantin Spiryagin (Petah-Tikva, IL)
Assignee: Highcon Systems Ltd.
B31B1/20C08L23/02C08L75/04C08L23/16C08L77/00C08G2280/00
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Quick Facts
Patent No.
US 8,777,828
App. No.
13/108,450
Granted
Jul 15, 2014
Kind
B2
Abstract

A co-layer surface-adhesive rule (SAR) that has a pre-defined cross-section profile. The co-layer surface-adhesive rule (SAR) has two or more layers, wherein at least one layer is made from flexible material and wherein at least two layers differ one from the other.

Claims (35)

1. A surface adhesive rule die comprising:

(a) a film substrate forming a die body;

(b) a plurality of elongate rules, each of said rules having:

a first elongate surface adhesively attached to a broad surface of said film substrate, and

an elongate protrusion distally protruding from said die body, said elongate protrusion having an elongate die surface, said elongate die surface including a polymeric material;

the surface adhesive rule die adapted such that when disposed generally opposite a counter die surface, and generally opposite a top surface of a cardboard workpiece disposed between said elongate die surface and said counter die surface, a pressure exerted by said elongate die surface against said cardboard workpiece forms an elongate depression in said top surface of said cardboard workpiece.

2. The surface adhesive rule die of claim 1 , said film substrate being a polymeric film substrate.

3. The surface adhesive rule die of claim 1 , said film substrate being sufficiently flexible to be flexed from a flat configuration into a cylindrical configuration.

4. The surface adhesive rule die of claim 1 , said film substrate being sufficiently flexible such that, from an initial, flat configuration, said film substrate can be wrapped around a drum.

5. The surface adhesive die rule of claim 4 , wherein said drum is a drum of a die base.

6. The surface adhesive die rule of claim 4 , further comprising said drum.

7. The surface adhesive die rule of claim 6 , further comprising a counter die having said counter die surface.

8. The surface adhesive rule die of claim 1 , said first elongate surface being adhesively attached to said broad surface along substantially an entire length of said first elongate surface.

9. The surface adhesive rule die of claim 1 , said first elongate surface being adhesively attached directly to said broad surface of said film substrate.

10. The surface adhesive rule die of claim 1 , each of said elongate rule dies being adhesively attached to said broad surface of said film substrate via an intermediate adhesive material disposed therebetween.

11. The surface adhesive rule die of claim 1 , at least one elongate rule of said plurality of elongate rules including at least two layers.

12. The surface adhesive rule die of claim 1 , at least one elongate rule of said plurality of elongate rules including at least two layers made of different materials.

13. The surface adhesive rule die of claim 1 , at least one elongate rule of said plurality of elongate rules including at least a bottom layer proximate to said die body, and a top layer, disposed above said bottom layer, distal to said die body, said top layer being more elastic with respect to said bottom layer.

14. The surface adhesive rule die of claim 1 , at least one elongate rule of said plurality of elongate rules having a generally rectangular cross-section.

15. The surface adhesive rule die of claim 1 , a top portion of at least one elongate rule of said plurality of elongate rules having a generally trapezoidal cross-section, said elongate die surface forming a portion of said trapezoidal cross-section.

16. The surface adhesive rule die of claim 1 , a top portion of at least one elongate rule of said plurality of elongate rules having a generally triangular cross-section, said elongate die surface forming a portion of said triangular cross-section.

17. The surface adhesive rule die of claim 1 , said elongate die surface of at least one elongate rule of said plurality of elongate rules having a generally rounded profile.

18. The surface adhesive rule die of claim 1 , a top portion of at least one elongate rule of said plurality of elongate rules having a generally rectangular cross-section, said elongate die surface forming a portion of said rectangular cross-section.

19. The surface adhesive rule die of claim 1 , an uppermost surface of at least one elongate rule of said plurality of elongate rules having an asymmetric profile.

20. The surface adhesive rule die of claim 1 , a layer of said film substrate having a thickness of about 25 microns.

21. The surface adhesive rule die of claim 1 , said film substrate having a thickness of about 50 microns.

22. The surface adhesive rule die of claim 1 , said film substrate having a thickness of about 80 microns.

23. The surface adhesive rule die of claim 1 , said film substrate including at least one of the materials selected from the group of polyethylene terephthalate, polyamide, and polypropylene.

24. The surface adhesive rule die of claim 1 , said film substrate including a flexible aluminum film.

25. The surface adhesive rule die of claim 1 , said film substrate including a flexible stainless steel film.

26. The surface adhesive rule die of claim 1 , at least one of said elongate rules having a height of up to several millimeters.

27. The surface adhesive rule die of claim 26 , said height being within a range of about 700 microns to about 1250 microns.

28. The surface adhesive rule die of claim 1 , at least one of said elongate rules having a width of up to several millimeters.

29. The surface adhesive rule die of claim 28 , said width being within a range of about 700 microns to about 1250 microns.

30. The surface adhesive rule die of claim 1 , said elongate rule containing silica.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2024
From: ZIMMER, MICHAEL; RATZMAN, AVIV; IDAN, DAVID; DAHAN, LIOR; SPIRYAGIN, KONSTANTIN
To: HIGHCON SYSTEMS LTD.
Reel/Frame 068328/0972 →
RELEASE OF SECURITY INTEREST Recorded Jan 12, 2020
From: BANK LEUMI LE-ISRAEL B.M.
To: HIGHCON SYSTEMS LTD.
Reel/Frame 051567/0984 →
ADDENDUM TO IP SECURITY INTEREST; REEL/FRAME: 0442214/0294 Recorded Oct 24, 2017
From: HIGHCON SYSTEMS LTD
To: BANK LEUMI LE-ISRAEL B.M.
Reel/Frame 044279/0943 →
SECURITY INTEREST Recorded Apr 9, 2017
From: HIGHCON SYSTEMS LTD
To: BANK LEUMI LE-ISRAEL B.M.
Reel/Frame 042214/0294 →
RELEASE OF SECURITY INTEREST Recorded May 28, 2015
From: NUSHA HOLDINGS LTD.; H.N.D. INVESTMENTS LTD.; NIKA HOLDINGS LTD.; SCINTILLA FUND LP
To: HIGHCON SYSTEMS LTD.
Reel/Frame 035734/0896 →
SECURITY INTEREST Recorded Oct 8, 2014
From: HIGHCON SYSTEMS LTD.
To: NUSHA HOLDINGS LTD.; H.N.D INVESTMENTS LTD.; NIKA HOLDINGS LTD.; SCINTILLA FUND LP
Reel/Frame 033917/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2011
From: ZIMMER, MICHAEL; RATZMAN, AVIV; IDAN, DAVID; DAHAN, LIOR; SPIRYAGIN, KOSTANTIN
To: HIGHCON SYSTEMS LTD
Reel/Frame 026382/0165 →
Continuity (2)
Provisional Application 61345180 · May 17, 2010
Related Publication 20120129672A1 · May 24, 2012