Semiconductor device and method for manufacturing the same
It is an object to provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a semiconductor device including an inverted staggered thin film transistor whose semiconductor layer is an oxide semiconductor layer, a buffer layer is provided over the oxide semiconductor layer. The buffer layer is in contact with a channel formation region of the semiconductor layer and source and drain electrode layers. A film of the buffer layer has resistance distribution. A region provided over the channel formation region of the semiconductor layer has lower electrical conductivity than the channel formation region of the semiconductor layer, and a region in contact with the source and drain electrode layers has higher electrical conductivity than the channel formation region of the semiconductor layer.
1. A semiconductor device comprising a transistor, the transistor comprising:
a first oxide semiconductor layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a source electrode over the second oxide semiconductor layer; and
a drain electrode over the second oxide semiconductor layer,
wherein the first oxide semiconductor layer includes a channel formation region,
wherein the second oxide semiconductor layer includes a first region overlapping with the channel formation region,
wherein the second oxide semiconductor layer includes a second region in contact with the source electrode,
wherein the second oxide semiconductor layer includes a third region in contact with the drain electrode,
wherein the first region is located between the source electrode and the drain electrode,
wherein a thickness of each of the second region and the third region is thicker than a thickness of the first region,
wherein the first region has a first electrical conductivity,
wherein the second region has a second electrical conductivity,
wherein the third region has a third electrical conductivity, and
wherein each of the second electrical conductivity and the third electrical conductivity is higher than the first electrical conductivity.
2. The semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises titanium.
3. The semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises molybdenum.
4. The semiconductor device according to claim 1 , wherein the second oxide semiconductor layer comprises manganese.
5. The semiconductor device according to claim 1 , wherein each of the source electrode and the drain electrode is in direct contact with a top surface of the second oxide semiconductor layer.
6. The semiconductor device according to claim 1 ,
wherein each of the source electrode and the drain electrode comprises a titanium film, and
wherein the titanium film is in direct contact with the second oxide semiconductor layer.
7. The semiconductor device according to claim 1 , further comprising an insulating film over the source electrode and the drain electrode,
wherein an entire top surface of the first region is in contact with the insulating film.
8. The semiconductor device according to claim 1 , wherein the semiconductor device is incorporated in one selected from the group consisting of a computer, a portable information terminal, a mobile phone, a camera and a television device.
9. A display module comprising the semiconductor device according to claim 1 , comprising an FPC.
10. An electronic apparatus comprising the semiconductor device according to claim 1 , comprising at least one of a speaker, a battery, and an operation key.
11. A semiconductor device comprising a transistor, the transistor comprising:
a first oxide semiconductor layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a source electrode over the second oxide semiconductor layer; and
a drain electrode over the second oxide semiconductor layer,
wherein the first oxide semiconductor layer includes a channel formation region,
wherein the second oxide semiconductor layer includes a first region overlapping with the channel formation region,
wherein the second oxide semiconductor layer includes a second region in contact with the source electrode,
wherein the second oxide semiconductor layer includes a third region in contact with the drain electrode,
wherein the first region is located between the source electrode and the drain electrode,
wherein a thickness of each of the second region and the third region is thicker than a thickness of the first region,
wherein the first region has a first electrical conductivity,
wherein the second region has a second electrical conductivity,
wherein the third region has a third electrical conductivity,
wherein each of the second electrical conductivity and the third electrical conductivity is higher than the first electrical conductivity, and
wherein the first region contains oxygen at a higher concentration than the second region and the third region.
12. The semiconductor device according to claim 11 , wherein the second oxide semiconductor layer comprises titanium.
13. The semiconductor device according to claim 11 , wherein the second oxide semiconductor layer comprises molybdenum.
14. The semiconductor device according to claim 11 , wherein the second oxide semiconductor layer comprises manganese.
15. The semiconductor device according to claim 11 , wherein each of the source electrode and the drain electrode is in direct contact with a top surface of the second oxide semiconductor layer.
16. The semiconductor device according to claim 11 ,
wherein each of the source electrode and the drain electrode comprises a titanium film, and
wherein the titanium film is in direct contact with the second oxide semiconductor layer.
17. The semiconductor device according to claim 11 , further comprising an insulating film over the source electrode and the drain electrode,
wherein an entire top surface of the first region is in contact with the insulating film.
18. The semiconductor device according to claim 11 , wherein the semiconductor device is incorporated in one selected from the group consisting of a computer, a portable information terminal, a mobile phone, a camera and a television device.
19. A display module comprising the semiconductor device according to claim 11 , comprising an FPC.
20. An electronic apparatus comprising the semiconductor device according to claim 11 , comprising at least one of a speaker, a battery, and an operation key.