IP Library › Granted Patent US 8,786,369
Granted Patent B2
US 8,786,369 · App. 13/557,609 · Granted Jul 22, 2014

High frequency amplifier

Inventor: Kazutaka Takagi (Kanagawa-ken, JP)
Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 8,786,369
App. No.
13/557,609
Granted
Jul 22, 2014
Kind
B2
Abstract

According to one embodiment, a high frequency amplifier having a division circuit, FET cells, a stabilization circuit and a combination circuit is provided. The division circuit divides an input signal to produce a plurality of signals. The FET cells amplify the signals produced by the division circuit. The stabilization circuit provided with RC parallel-connected circuits which are respectively connected in series between the division circuit and gates of the FET cells. Each of the RC parallel-connected circuits has a capacitor and a resistor connected in parallel with each other. The combination circuit combines the signals amplified by the FET cells.

Claims (21)

1. A high frequency amplifier, comprising:

a division circuit which divides an input signal to produce a plurality of signals;

FET cells which amplifies signals produced by the division circuit;

a stabilization circuit provided with RC parallel-connected circuits which are respectively connected in series between the division circuit and gates of the FET cells, each of the RC parallel-connected circuits having a capacitor and a resistor connected in parallel with each other; and

a combination circuit which combines signals amplified by the FET cells, wherein the stabilization circuit is arranged on a substrate other than a semiconductor substrate on which the FET cells are arranged.

2. A high frequency amplifier according to claim 1 , wherein each of the FET cells and each of the RC parallel-connected circuits are connected with each other through a wire, respectively.

3. A high frequency amplifier according to claim 1 , wherein the division circuit, the stabilization circuit and the combination circuit are respectively arranged on substrates other than a semiconductor substrate on which the FET cells are arranged.

4. A high frequency amplifier according to claim 3 , wherein the division circuit and the stabilization circuit are arranged on the same substrate other than a semiconductor substrate on which the FET cells are arranged.

5. A high frequency amplifier according to claim 3 , wherein the stabilization circuit includes:

a circuit substrate of a dielectric material;

a first electrode formed on the circuit substrate;

a dielectric layer formed on the first electrode, the resistor being formed on the dielectric layer;

a second electrode formed on the dielectric layer to compose the capacitor with the first electrode and the dielectric layer; and

a third electrode formed in a through hole which is provided in the dielectric layer and connects the first electrode with the resistor electrically.

6. A high frequency amplifier according to claim 4 , wherein the stabilization circuit includes:

a circuit substrate of a dielectric material;

a resistor formed on the circuit substrate;

a capacitor formed on the circuit substrate, the capacitor having a first electrode, a dielectric layer formed on the first electrode, and a second electrode formed on the dielectric layer;

a first conductive line which connects an end of the resistor and the first electrode electrically; and

a second conductive line which connects the other end of the resistor and the second electrode electrically.

7. A high frequency amplifier according to claim 1 , wherein the substrate other than the semiconductor substrate is a dielectric substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2012
From: TAKAGI, KAZUTAKA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 028636/0097 →
Priority Claims (1)
JP P2011-250470 · Nov 16, 2011 · national
Continuity (1)
Related Publication 20130120069A1 · May 16, 2013