Semiconductor manufacturing apparatus member
A ceramic heater includes a disk-shaped ceramic plate and a shaft. The ceramic plate includes a wafer-placing surface. The shaft has a hollow shape and is bonded to a surface of the ceramic plate opposite to the wafer-placing surface. A thermocouple conduit is formed in the ceramic plate so as to extend from a central portion of the ceramic plate to a position which is short of an outer peripheral surface of the ceramic plate. A thermocouple guide having a pipe-like shape is attached to the back surface of the ceramic plate. A guide hole in the thermocouple guide is connected to a portion of the thermocouple conduit at the central portion of the ceramic plate. The guide hole is disposed so as to be inclined with respect to the direction in which the thermocouple conduit extends.
1. A semiconductor manufacturing apparatus member comprising:
a disk-shaped ceramic plate including a wafer-placing surface;
a thermocouple conduit disposed in the ceramic plate and extends from a radially central portion of the ceramic plate to a position which is spaced from an outer peripheral surface of the ceramic plate;
a thermocouple guide including a guide hole extending from a surface of the ceramic plate opposite to the wafer-placing surface and is connected to a portion of the thermocouple conduit at the radially central portion of the ceramic plate; and
a thermocouple extending through the guide hole and the thermocouple conduit, the thermocouple being disposed so that a temperature sensing portion thereof is in contact with a closed end of the thermocouple conduit, the closed end being located at the position which is spaced from the outer peripheral surface of the ceramic plate,
wherein the guide hole is inclined with respect to a direction in which the thermocouple conduit extends so that the guide hole makes an obtuse angle with the thermocouple conduit, or the guide hole extends in a direction closer to the direction in which the thermocouple conduit extends with decreasing distance of the guide hole from the thermocouple conduit,
the ceramic plate includes a pair of thin plates that are surface-bonded to each other, and
the thermocouple conduit is formed by a radial passage groove formed in a bonding surface of at least one of the pair of thin plates.
2. The semiconductor manufacturing apparatus member according to claim 1 ,
wherein a portion of the guide hole that extends in a direction closer to the direction in which the thermocouple conduit extends with decreasing distance of the guide hole from the thermocouple conduit is formed as a circular arc or an elliptic arc.
3. The semiconductor manufacturing apparatus member according to claim 1 ,
wherein the thermocouple guide is made from the same material as the ceramic plate.
4. The semiconductor manufacturing apparatus member according to claim 1 ,
wherein the thermocouple is pressed by a spring so that the temperature sensing portion is in contact with the closed end.
5. The semiconductor manufacturing apparatus member according to claim 1 ,
wherein the passage groove includes a support portion for supporting the temperature sensing portion of the thermocouple at an end portion at which the passage groove is in contact with the temperature sensing portion.
6. A semiconductor manufacturing apparatus member comprising:
a disk-shaped ceramic plate including a wafer-placing surface;
a thermocouple conduit disposed in the ceramic plate and extends from a radially central portion of the ceramic plate to a position which is spaced from an outer peripheral surface of the ceramic plate;
a thermocouple guide including a guide hole extending from a surface of the ceramic plate opposite to the wafer-placing surface and is connected to a portion of the thermocouple conduit at the radially central portion of the ceramic plate; and
a thermocouple extending through the guide hole and the thermocouple conduit, the thermocouple being disposed so that a temperature sensing portion thereof is in contact with a closed end of the thermocouple conduit, the closed end being located at the position which is spaced from the outer peripheral surface of the ceramic plate,
wherein the guide hole is inclined with respect to a direction in which the thermocouple conduit extends so that the guide hole makes an obtuse angle with the thermocouple conduit, or the guide hole is extends in a direction closer to the direction in which the thermocouple conduit extends with decreasing distance of the guide hole from the thermocouple conduit, and
the thermocouple conduit is a hole that is radially formed by drilling the ceramic plate from the outer peripheral surface toward a radial center of the ceramic plate, and sealing an end portion of the thermocouple conduit that is open in the outer peripheral surface with a cap that is made from the same material as the ceramic plate.
7. The semiconductor manufacturing apparatus member according to claim 6 ,
wherein the cap includes a support portion that supports the temperature sensing portion of the thermocouple at a position at which the cap is in contact with the temperature sensing portion.
8. The semiconductor manufacturing apparatus member according to claim 6 ,
wherein a portion of the guide hole that extends in a direction closer to the direction in which the thermocouple conduit extends with decreasing distance of the guide hole from the thermocouple conduit is formed as a circular arc or an elliptic arc.
9. The semiconductor manufacturing apparatus member according to claim 6 ,
wherein the thermocouple guide is made from the same material as the ceramic plate.
10. The semiconductor manufacturing apparatus member according to claim 6 ,
wherein the thermocouple is pressed by a spring so that the temperature sensing portion is in contact with the closed end.