Process kit components for titanium sputtering chamber
A process kit for a sputtering chamber comprises a deposition ring, cover ring, and a shield assembly, for placement about a substrate support in a sputtering chamber. The deposition ring comprising an annular band with an inner lip extending transversely, a raised ridge substantially parallel to the substrate support, an inner open channel, and a ledge radially outward of the raised ridge. A cover ring at least partially covers the deposition ring, the cover ring comprising an annular plate comprising a footing which rests on a surface about the substrate support, and downwardly extending first and second cylindrical walls.
1. A deposition ring for placement about a substrate support in a sputtering chamber, the substrate support comprising a substrate receiving surface having a plane and a peripheral wall that terminates before an overhanging edge of a substrate received on the substrate receiving surface, the deposition ring comprising:
(a) an annular band surrounding the peripheral wall of the support, the annular band being composed of a material and having an exposed surface that is a roughened surface of the material,. the annular band comprising:
(i) an inner lip extending transversely from the annular band, the inner lip being substantially parallel to the peripheral wall of the support and terminating below the overhanging edge of the substrate;
(ii) a raised ridge that is substantially parallel to the plane of the receiving surface of the substrate support;
(iii) an inner open channel between the inner lip and the raised ridge, the inner open channel extending at least partially below the overhanging edge of the substrate; and
(iv) a ledge radially outward of the raised ridge.
2. A ring according to claim 1 wherein the annular band is composed of aluminum oxide.
3. A ring according to claim 2 wherein the aluminum oxide has a purity of at least about 99.5%.
4. A ring according to claim 1 wherein the exposed roughened surface of the material comprises a surface roughness average of 150±50 microinches.
5. A ring assembly comprising a deposition ring according to claim 1 and further comprising a cover ring, wherein the raised ridge of the annular band of the deposition ring and a spaced apart and overlying undersurface of the cover ring, define a narrow gap which impedes travel of plasma species through the gap.
(a) a deposition ring comprising an annular band surrounding the peripheral wall of the support, the annular band composed of a material and having an exposed surface that is a roughened surface of the material, the annular band comprising:
(i) an inner lip extending transversely from the annular band, the inner lip being substantially parallel to the peripheral wall of the support and terminating below the overhanging edge of the substrate;
(ii) a raised ridge that is substantially parallel to the plane of the receiving surface of the substrate support;
(iii) an inner open channel between the inner lip and the raised ridge, the inner open channel extending at least partially below the overhanging edge of the substrate; and
(iv) a ledge radially outward of the raised ridge; and
(b) a cover ring at least partially covering the deposition ring, the cover ring comprising:
(i) an annular plate composed of a material and comprising a footing which rests on a surface about the substrate support, the annular plate having an exposed surface that is a roughened surface of the material and substantially parallel to the receiving surface of the substrate support; and
(ii) first and second cylindrical walls extending downwardly from the annular plate, the first cylindrical wall having a first length that is shorter than a second length of the second cylindrical wall by at least about 10%.
6. A ring according to claim 1 wherein the inner open channel of the annular band comprises a rounded corner that is joined to the inner lip.
7. A ring according to claim 1 wherein the inner open channel of the annular band comprises a sloped surface that is joined to the raised ridge.
8. A ring assembly according to claim 5 wherein the ledge of the annular band comprises a surface to support the cover ring.
9. A ring assembly according to claim 5 wherein the cover ring comprises an annular plate having a footing which rests on a surface about the substrate support.
10. A ring assembly according to claim 9 wherein the annular plate is composed of a material and has an exposed surface that is a roughened surface of the material.
11. A ring assembly according to claim 9 wherein the annular plate comprises downwardly extending first and second cylindrical walls, the first cylindrical wall having a first length that is shorter than a second length of the second cylindrical wall.
12. A ring assembly according to claim 11 wherein the first length is shorter than the second length by at least 10%.
13. A ring assembly according to claim 5 wherein the annular plate is composed of stainless steel.
14. A ring assembly according to claim 5 wherein the annular plate comprises an exposed surface that is a bead blasted surface.
15. A deposition ring according to claim 1 wherein the roughened surface of the material comprises a bead blasted exposed surface with a surface roughness average of 150±50 microinches.
16. A ring assembly according to claim 10 wherein the roughened surface of the material comprises a bead blasted exposed surface with a surface roughness average of 175±75 microinches.