Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
A method for manufacturing an electronic circuit in three-dimensional space provides for interconnecting electronic components within the circuit by directly writing conducting lines. The method may include observing a direct writing tool of a direct write system using a vision system, determining proper placement of the direct writing tool at least partially based on the step of observing, and directly writing conducting lines in three dimensions using the proper placement. The direct writing may be on a surface or in free space. The method may include stacking a plurality of chips to provide a stack having a top surface and edges extending away from the top and interconnecting connections of the chips by directly writing conducting lines along one of the edges.
1. A method for fabricating a three-dimensional electronic circuit, comprising:
providing a system for fabricating a three-dimensional electronic circuit, the system comprising (a) a direct write system adapted for directly writing conducting lines for the three-dimensional circuit in three dimensions to thereby allow the conducting lines to be written on substrates, conformal surfaces, and in free space without any supporting substrate and (b) a computer control system in operative communication with the direct write system configured to control the direct write system to precisely place the conducting lines for the three-dimensional circuit in each of the three dimensions including directly writing a conducting line in free space such that at least a portion of the conducting line is not directly attached to any surface;
directly writing conducting lines within the three-dimensional electronic circuit using the system;
wherein the direct write system is a direct write microdispensing system.
2. The method of claim 1 wherein the direct write system provides for the conducting lines to be written with a pre-curable conductive paste and wherein the directly writing the conducting lines is performed using the pre-curable conductive paste and wherein the method further comprises pre-curing the conducting lines.
3. The method of claim 1 wherein the system further comprises a vision system and the method further comprises using the vision system to assist in controlling the direct write system.
4. The method of claim 3 wherein the vision system is a stereoscopic vision system.
5. The method of claim 1 further comprising directly writing dielectric material with the direct write system.
6. The method of claim 1 wherein the direct write system comprises a plurality of tools and wherein each of the plurality of tools is configured for directly writing a different substance, and at least one of the plurality of tools configured for directly writing conducting lines with a conducting substance.
7. The method of claim 6 wherein at least one of the plurality of tools is configured for writing a dielectric material.
8. A method for fabricating a three-dimensional electronic circuit, comprising:
providing a system for fabricating a three-dimensional electronic circuit, the system comprising (a) a direct write microdispensing system adapted for directly writing conducting lines for the three-dimensional circuit in three dimensions to thereby allow the conducting lines to be written on substrates, conformal surfaces, and in free space without any supporting substrate, (b) a computer control system in operative communication with the direct write microdispensing system configured to control the direct write microdispensing system to precisely place the conducting lines for the three-dimensional circuit in each of the three dimensions, and (c) wherein the direct write microdispensing system comprises a plurality of microdispensing tools and wherein each of the plurality of tools is configured for directly writing a different substance, the plurality of microdispensing tools comprising a first microdispensing tool for writing conducting lines and a second microdispensing tool for writing features formed with a dielectric material;
microdispensing the conducting lines within the three-dimensional electronic circuit using the first microdispensing tool of the system such that at least a portion of one of the conducting lines is not attached to any surface; and
microdispensing the features formed with the dielectric material within the three-dimensional circuit using the second microdispensing tool of the system.
9. The method of claim 8 wherein the features formed with the dielectric material are isolation bands or patches.
10. The method of claim 8 wherein the microdispensing the conducting lines is performed using a pre-curable conductive paste and wherein the method further comprises pre-curing the conducting lines.
11. A method for fabricating a three-dimensional electronic circuit comprising providing a system for fabricating a three-dimensional electronic circuit, the system comprising:
a direct write system adapted for directly writing conducting lines for the three-dimensional circuit in three dimensions including by interconnecting an electrical connection of a first electronic component and an electrical connection of a second electronic component by directly writing a conducting line in three-dimensions from the electrical connection of the first electronic component to the electrical connection of the second electrical component, wherein the directly writing the conducting line in three dimensions comprises directly writing the conducting line in free space such that at least a portion of the conducting line is not directly attached to any surface;
directly writing conducting lines within the three-dimensional electronic circuit using the system.
12. The method of claim 11 wherein the directly writing the conducting lines comprises directly writing the conducting lines on a non-planar surface.
13. The method of claim 11 wherein the directly writing the conducting lines comprises directly writing the conducting lines on a device enclosure.
14. The method of claim 11 further comprising directly writing an antenna using the system.
15. The method of claim 11 wherein the directly writing the conducting lines comprises directly writing the conducting lines on electronic components using the system.
16. The method of claim 11 further comprising directly writing dielectrics within the three-dimensional electronic circuit using the system.
17. The method of claim 11 further comprising directly writing insulating patches within the three-dimensional electronic circuit using the system.
18. The method of claim 11 further comprising directly writing electrodes within the three-dimensional electronic circuit using the system.
19. The method of claim 11 wherein the conducting lines are formed from a silver powder paste.
20. The method of claim 11 further comprising pre-curing the conducting lines after writing.
21. A method for fabricating a three-dimensional electronic circuit, comprising:
providing a system for fabricating a three-dimensional electronic circuit, the system comprising (a) a direct write system adapted for (1) directly writing conducting lines for the three-dimensional circuit in three dimensions to thereby allow the conducting lines to be written on substrates, conformal surfaces, and in free space and (2) directly writing electronic components for the three-dimensional circuit and (b) a computer control system in operative communication with the direct write system configured to control the direct write system to precisely place the conducting lines and the electronic components for the three-dimensional circuit in each of the three dimensions;
directly writing conducting lines within the three-dimensional electronic circuit using the system such that at least a portion of one of the conducting lines is not directly attached to any surface; and
directly writing electronic components within the three-dimensional electronic circuit using the system.
22. The method of claim 21 wherein the directly writing the conducting lines comprises directly writing the conducting lines on a non-planar surface.
23. The method of claim 21 wherein the directly writing the conducting lines comprises directly writing the conducting lines on a device enclosure.
24. The method of claim 21 further comprising directly writing an antenna using the system.
25. The method of claim 21 wherein the directly writing the conducting lines comprises directly writing the conducting lines on electronic components using the system.
26. The method of claim 21 wherein the electronic components comprise resistors.
27. The method of claim 21 further comprising directly writing dielectrics within the three-dimensional electronic circuit using the system.
28. The method of claim 21 further comprising directly writing insulating patches within the three-dimensional electronic circuit using the system.
29. The method of claim 21 further comprising directly writing electrodes within the three-dimensional electronic circuit using the system.
30. The method of claim 21 wherein the conducting lines are formed from a silver powder paste.
31. The method of claim 21 further comprising pre-curing the conducting lines after writing.