IP Library › Granted Patent US 8,791,385
Granted Patent B2
US 8,791,385 · App. 12/417,112 · Granted Jul 29, 2014

High speed laser scribing method of fragile material

Inventor: Yutaka Tamura (Uji, JP)
Assignee: Lemi Co., Ltd.
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Quick Facts
Patent No.
US 8,791,385
App. No.
12/417,112
Granted
Jul 29, 2014
Kind
B2
Abstract

In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values. By the method, it is possible to remarkably increase scribing speed of the work plate of the fragile materials without increasing heating temperature.

Claims (24)

1. A method for scribing fragile material comprising the steps of;

irradiating laser beam onto a work plate of the fragile material,

heating the work plate by absorption of the irradiated laser beam and generating thermal stress by the heating, wherein

the laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and

adjusting independently the laser beam intensity corresponding to each of the laser beam groups.

2. A method for scribing fragile material according to claim 1 , wherein the plurality of laser beam groups are divided in two groups,

wherein the laser beam intensity of one of the groups is controlled to perform initial heating to raise the temperature of the work plate, and

the laser beam intensity of the other of the two groups is separately controlled to perform holding of the temperature of the work plate.

3. A method for scribing fragile material according to claim 2 , wherein each of the two laser beam groups is obtained by a laser beam emitted from an individual laser oscillator.

4. A method for scribing fragile material according to claim 2 , wherein each of the two laser beam groups is obtained by multi-point arrangement of the laser beams each emitted from a beam splitter to which a single laser beam is incident from a single laser oscillator.

5. A method for scribing fragile material according to claim 2 , wherein each of the laser beams of two laser beam groups is generated by a laser oscillator circuit, the laser oscillator circuit comprising a laser oscillator, a driver for driving the laser oscillator and a power meter for monitoring output power of the laser oscillator connected with each other to form a feedback loop for controlling laser output power.

6. A method for scribing fragile material according to claim 1 , wherein cooling process is further provided for cooling a certain area of the work plate on the laser beam scanning line apart behind the heated region of the work plate by a coolant.

7. A method for scribing fragile material according to claim 1 , wherein bending stress is applied to the work plate along a beam scanning direction on a same line after heating the work plate by laser beam irradiation.

8. A method for scribing fragile material comprising the steps of;

irradiating laser beam onto a work plate of the fragile material,

heating the work plate by absorption of the irradiated laser beam and generating thermal stress by the heating, wherein

the laser beam is formed by a first laser beam for initial heating of the work plate and a second laser beam for temperature holding of the work plate,

adjusting the laser output power intensity of the first laser beam to be larger than that of the second laser beam by adjusting independently the laser beam intensity of each of the first laser beam and the second laser beam; and

the first laser beam and the second laser beam are arranged in such a manner that they are not overlapped with each other along a beam scanning direction on a same line of the work plate when irradiated on the work plate.

9. A method for scribing fragile material according to claim 8 , wherein each of the each of the first and second laser beam is obtained by a laser beam emitted from an individual laser oscillator.

10. A method for scribing fragile material according to claim 8 , wherein each of the first and second laser beam is obtained by multi-point arrangement of the laser beams each emitted from a beam splitter to which a single laser beam is incident from a single laser oscillator.

11. A method for scribing fragile material according to claim 8 , wherein each of the first and second laser beams generated by a laser oscillator circuit, the laser oscillator circuit comprising a laser oscillator, a driver for driving the laser oscillator and a power meter for monitoring output power of the laser oscillator connected with each other to form a feedback loop for controlling laser output power.

12. A method for scribing fragile material according to claim 8 , wherein cooling process is further provided for cooling a certain area of the work plate on the laser beam scanning line apart behind the heated region of the work plate by a coolant.

13. A method for scribing fragile material according to claim 8 , wherein bending stress is applied to the work plate along a beam scanning direction on a same line after heating the work plate by laser beam irradiation.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2016
From: LEMI CO., LTD.
To: GLOBALLY TECH CO., LTD.
Reel/Frame 038167/0977 →
CHANGE OF ADDRESS Recorded Jul 15, 2011
From: LEMI CO., LTD.
To: LEMI CO., LTD.
Reel/Frame 026602/0432 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2009
From: TAMURA, YUTAKA
To: LEMI CO., LTD.
Reel/Frame 022612/0120 →
Priority Claims (1)
JP 2008-100887 · Apr 8, 2008 · national
Continuity (1)
Related Publication 20100089882A1 · Apr 15, 2010