IP Library › Granted Patent US 8,791,449
Granted Patent B2
US 8,791,449 · App. 13/305,649 · Granted Jul 29, 2014

Nanostructured silicon for battery anodes

Inventors: Brent A. Buchine (Watertown, MA); Faris Modawar (Georgetown, TX); Marcie R. Black (Lincoln, MA)
Assignee: Bandgap Engineering, Inc.
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Quick Facts
Patent No.
US 8,791,449
App. No.
13/305,649
Granted
Jul 29, 2014
Kind
B2
Abstract

A process is provided for etching a silicon-containing substrate to form nanowire arrays. In this process, one deposits nanoparticles and a metal film onto the substrate in such a way that the metal is present and touches silicon where etching is desired and is blocked from touching silicon or not present elsewhere. One submerges the metallized substrate into an etchant aqueous solution comprising HF and an oxidizing agent. In this way arrays of nanowires with controlled diameter and length are produced.

Claims (9)

1. A nanowire array comprising polycrystalline silicon, wherein the nanowires of the array have their lengthwise directions at a non-zero angle to a silicon-containing substrate, wherein the array is formed by etching a substrate composed primarily of amorphous.

2. The nanowire array of claim 1 , wherein the majority of the nanowires in the array have diameters of no more than 150 nm.

3. A process of manufacturing an anode material for lithium ion batteries comprising nanostructured silicon, comprising the step of etching a silicon-containing substrate using a metal as a catalyst, wherein the nanostructured silicon comprises silicon nanowires, wherein the silicon nanowires are formed by etching a substrate composed primarily of amorphous or polycrystalline silicon.

4. The process of claim 3 , wherein the metal used as a catalyst comprises silver.

5. The process of claim 3 , wherein the etching is carried out in the presence of an oxidizing agent less reactive than H 2 O 2 .

6. The process of claim 5 , wherein the oxidizing agent is oxygen gas bubbled through an etchant aqueous solution.

7. The process of claim 4 , wherein the step of etching comprises depositing a continuous film of silver.

8. The process of claim 3 , wherein the silicon nanowires are at an angle from the substrate which is different from perpendicular.

9. The process of claim 3 , wherein the step of etching comprises depositing a film having an average thickness of no more than about 40 nm.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2020
From: ADVANCED SILICON GROUP, INC.
To: ADVANCED SILICON GROUP TECHNOLOGIES, LLC
Reel/Frame 054143/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2015
From: BUCHINE, BRENT A.; MODAWAR, FARIS; BLACK, MARCIE R.
To: BANDGAP ENGINEERING, INC.
Reel/Frame 036520/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2015
From: MASSACHUSETTS GREEN ENERGY FUND I LP; DANE SHULMAN ASSOCIATES, LLC; BLACK, MARCIE R.; CHLEBOSKI, RICHARD; SHAW, ROBERT W., JR.; ADAMS, TRACY; NEW ENTERPRISE ASSOCIATES 12, LP
To: ADVANCED SILICON GROUP, INC.
Reel/Frame 036521/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2015
From: BANDGAP ENGINEERING, INC.
To: MASSACHUSETTS GREEN ENERGY FUND I LP; DANE SHULMAN ASSOCIATES, LLC; BLACK, MARCIE R.; CHLEBOSKI, RICHARD; SHAW, ROBERT W., JR.; ADAMS, TRACY; NEW ENTERPRISE ASSOCIATES 12, LP
Reel/Frame 036574/0911 →
Continuity (4)
Continuation 12423623 · Apr 14, 2009
Provisional Application 61044573 · Apr 14, 2008
Provisional Application 61141082 · Dec 29, 2008
Related Publication 20120301785A1 · Nov 29, 2012