Focus-fixed camera module
The present disclosure relates to a focus-free camera module minimized in height deviation of depth of focus, the focus-fixed focus-free camera module including: an image sensor; a PCB (Printed Circuit Board) mounted with the image sensor; a barrel mounted at an upper surface of the image sensor and accommodated with a lens therein; a holder attached to an upper surface of the PCB to accommodate the barrel; and adhesive means adhering an outer circumference of the barrel to an inner circumference of the holder, such that no height deviation in depth of focus is generated by adhesive structure in which a bottom distal end surface of the barrel is tightly adhered to an upper surface of an image sensor side without any separate medium.
1. A camera module, the camera module comprising:
an image sensor;
a PCB (Printed Circuit Board) mounted with the image sensor;
a barrel fixed at an upper surface of the image sensor and accommodated with a lens therein; and
a holder attached to an upper surface of the PCB to accommodate the barrel;
wherein the barrel is configured such that an inner circumference of the holder is adhered to an outer circumference of the barrel by adhesive means to allow the barrel to be fixed on the upper surface of the image sensor,
wherein the barrel is taller than the holder, and
wherein the adhesive means is injected on an exposed area of the outer circumference of the barrel after mounting of the barrel and holder.
2. The camera module of claim 1 , wherein the adhesive means mutually couples the barrel and an upper distal end of the holder.
3. The camera module of claim 1 , wherein the adhesive means is a thermosetting resin.
4. The camera module of claim 3 , wherein the adhesive means is an epoxy.
5. The camera module of claim 1 , wherein the image sensor is a chip-on-board (COB) type sensor.
6. The camera module of claim 5 , wherein a bottom distal end surface of the barrel is tightly adhered to an upper surface of the image sensor.
7. The camera module of claim 1 , wherein the image sensor is a chip scale package (CSP) type sensor, and the image sensor is further formed at an upper surface with a cover member.
8. The camera module of claim 7 , wherein the bottom distal end surface of the barrel is tightly adhered to an upper surface of the cover member.
9. The camera module of claim 1 , wherein depth of focus is determined by a mechanism height of the barrel.
10. The camera module of claim 1 , wherein the holder functions as a guide guiding an assembly position of the barrel.
11. A camera module, the camera module comprising:
an image sensor;
a PCB (Printed Circuit Board) mounted with the image sensor;
a barrel fixed at an upper surface of the image sensor and accommodated with a lens therein; and
a holder attached to an upper surface of the PCB to accommodate the barrel in an inner space;
wherein the barrel is configured such that an upper outer circumference of the barrel is adhered to an inner circumference of the holder opposite to the upper outer circumference of the barrel, using adhesive means to allow the barrel to be fixed on the upper surface of the image sensor after mounting of the barrel and holder.
12. The camera module of claim 11 , wherein the adhesive means is a thermosetting epoxy resin.
13. The camera module of claim 11 , wherein the image sensor is a chip-on-board (COB) type sensor.
14. The camera module of claim 13 , wherein a bottom distal end surface of the barrel is tightly adhered to an upper surface of the image sensor.
15. The camera module of claim 11 , wherein the image sensor is a chip scale package (CSP) type sensor, and the image sensor is further formed at an upper surface with a cover member.
16. The camera module of claim 15 , wherein the bottom distal end surface of the barrel is tightly adhered to an upper surface of the cover member.
17. The camera module of claim 11 , wherein depth of focus is determined by a mechanism height of the barrel.
18. The camera module of claim 11 , wherein the holder functions as a guide guiding an assembly position of the barrel.
19. The camera module of claim 11 , wherein the holder is fixed to an upper lateral surface of the PCB using holder adhesive means.
20. The camera module of claim 19 , wherein the holder adhesive means is provided with a same material as that of the adhesive means, wherein the holder adhesive means and the adhesive means are thermosetting epoxy resin.