Piezo-resistive force sensor with bumps on membrane structure
A force sensor to measure a force from a load includes a plunger, a flexible disc-shaped membrane, a support plate and a silicon die. The plunger is configured to receive the force from the load, and has a ring-shaped groove at the lower surface. The membrane has a ring-shaped upper bump at the upper surface configured to complementarily fit into the groove at the lower surface of plunger and a ring-shaped lower bump at lower upper surface. The support plate has a ring-shaped groove for complementary fit into the lower bump on the lower surface of the membrane. The silicon die is centrally mounted on the membrane and comprises piezo-resistors with resistance that varies when deformed by the force. Force received by the plunger is transmitted to the membrane, causing the membrane to flex and bending or compressing of the silicon die, resulting in the measurement of the force.
1. A device to measure the force from a load, the device comprising:
a plunger configured to receive the force from the load, wherein a lower surface of the plunger has a ring-shaped first groove;
a disc-shaped membrane having an upper surface and lower surface, wherein the membrane is flexible according to the force received by the plunger, wherein the upper surface of the membrane has a ring-shaped first bump configured to complementarily fit into the first groove on the lower surface of the plunger, and wherein the lower surface of the membrane has a ring-shaped second bump;
a sensor centrally disposed on the membrane, wherein the sensor measures the force of the load when being bent or compressed caused by the membrane; and
a support plate having a ring-shaped second groove configured to complementarily fit into the second bump, wherein the force received by the plunger from the load is transmitted to the membrane, causing the membrane to flex, which in turn causes the bending or compressing of the sensing means, resulting in the measurement of the force from the load.
2. The device according to claim 1 further comprising:
a convex step centrally disposed on the lower surface of the membrane to secure the sensor between the lower surface of the membrane and the support plate.
3. The device according to claim 2 , wherein the support plate further comprises a depression configured to support the silicon die.
4. The device according to claim 2 , wherein the ring-shaped second bump has at least one gap to provide a passage for an electrical connector to couple the silicon die to other electronic components.
5. The device according to claim 1 , wherein the sensor is centrally mounted on the upper surface of the membrane.
6. The device according to claim 1 , wherein the sensor is centrally mounted on the lower surface of the membrane.
7. The device according to claim 1 , wherein the ring-shaped first bump has a smaller diameter than the ring-shaped second bump.
8. The device according to claim 1 , wherein the ring-shaped first bump has a larger diameter than the ring-shaped second bump.
9. The device according to claim 1 , wherein the sensor is a silicon die with a plurality of integrated piezo-resistors having a varying resistance when bent or compressed.
10. A braking system coupled to at least one wheel of a vehicle to control the braking force on the wheel, the braking system comprising:
a pedal to apply initial braking pressure to the wheel;
a braking device coupled to the wheel and configured to apply the initial braking pressure on the wheel; and
a sensor to measure the braking pressure applied to the wheel, the sensor comprising:
a plunger configured to receive the applied braking force, and having a ring-shaped first groove on a lower surface of the plunger;
a disc-shaped membrane having an upper surface and lower surface, wherein the membrane is flexible according to the applied braking force received by the plunger, wherein an upper surface of the membrane has a ring-shaped first bump configured to complementarily fit the first groove, and wherein the lower surface of the membrane has a ring-shaped second bump;
a sensing circuit centrally disposed on the membrane, wherein the sensing circuit measures the applied braking force when being bent or compressed caused by the membrane;
a support plate having a ring-shaped second groove configured to complementarily fit the second bump, whereby the applied braking force received by the plunger is transmitted to the membrane, causing the membrane to flex, which in turn causes the bending or compressing of the sensing circuit, resulting in the measurement of the applied braking force; and
a control unit electrically coupled to the braking device to control the braking pressure on the wheel, wherein the control unit is configured to receive the measurement of the applied braking force from the braking device, and to process the measurement of the applied braking force to control the braking pressure on the wheel.
11. The braking system according to claim 10 , wherein the braking device applies the braking pressure on a disc mounted on the wheel.
12. The braking system according to claim 11 , wherein the braking device further comprises a plurality of brake pads to apply the braking pressure on the wheel.
13. The braking system according to claim 12 , wherein the braking device further comprises:
a plurality of electric motors coupled to the plurality of brake pads, wherein the plurality of electric motors drive the plurality of brake pads to apply the braking pressure on the wheel.
14. The braking system according to claim 13 , wherein the plurality of electric motors are coupled to the plurality of brake pads via reduction gear, the reduction gear configured to transform the rotational motion of the plurality of electric motors to the translation motion of the plurality of brake pads, thereby causing the plurality of brake pads to apply the braking pressure on the wheel.
15. The braking system according to claim 14 , wherein the reduction gear is coupled to the plunger of the sensor to enable the sensor to measure the braking pressure applied to the wheel.
16. The braking system according to claim 10 , wherein the sensing circuit is coupled to the control unit.
17. The braking system according to claim 10 , wherein the membrane of the sensor further comprises a convex step centrally disposed on the lower surface, wherein the convex step secures the sensing circuit between the lower surface of the membrane and the support plate.
18. The braking system according to claim 17 , wherein the support plate of the sensor further comprises a depression configured for supporting the silicon die.
19. The braking system according to claim 17 , wherein the ring-shaped second bump has at least one gap that provides a passage for an electrical connector to couple the silicon die to other electronic components.
20. The braking system according to claim 10 , wherein the sensing circuit is centrally mounted on the upper surface of the membrane.
21. The braking system according to claim 10 , wherein the sensing circuit is centrally mounted on the lower surface of the membrane.
22. The braking system according to claim 10 , wherein the ring-shaped first bump has a smaller diameter than the ring-shaped second bump.
23. The braking system according to claim 10 , wherein the ring-shaped first bump has a larger diameter than the ring-shaped second bump.
24. The braking system according to claim 10 , wherein the sensing means is a silicon die with a plurality of integrated piezo-resistors that vary their resistance when bent or compressed.