Semiconductor device with field threshold MOSFET for high voltage termination
View Patent ↗This invention discloses a semiconductor power device disposed in a semiconductor substrate comprising a lightly doped layer formed on a heavily doped layer and having an active cell area and an edge termination area. The edge termination area comprises a plurality P-channel MOSFETs. By connecting the gate to the drain electrode, the P-channel MOSFET transistors formed on the edge termination are sequentially turned on when the applied voltage is equal to or greater than the threshold voltage Vt of the P-channel MOSFET transistors, thereby optimizing the voltage blocked by each region.
1. A method for manufacturing a Semiconductor Power device disposed on a semiconductor layer of a first conductivity type comprising an active area and a termination area, the method further comprising:
forming a power device in the active area and forming a plurality of laterally cascaded MOSFETs in the termination area by forming a plurality of dopant floating guard rings (FGRs) of a second conductivity type each encompassing a heavy dopant region of the second conductivity type to function as drain regions and source regions of the laterally cascaded MOSFETs wherein the drain and source regions disposed in two adjacent FGRs on opposite sides of a gate disposed on a top surface of the semiconductor layer extending over the two adjacent FGRs above a dopant region of the first conductivity type disposed between the two adjacent FGRs and forming the dopant region of the first conductivity type between the two adjacent FGRs to adjust a threshold of turning on the MOSFET for applying a voltage between the source region and the drain region disposed laterally on two opposite sides of the dopant region of the first conductivity type; and
connecting each of the gates of the laterally cascaded MOSFETs to the drain region of the second conductivity type of each of the cascaded lateral MOSFETs functioning as a chain of field threshold MOSFETs in the termination area.
2. The method of claim 1 further comprising:
forming the semiconductor layer of the first conductivity type on top of a semiconductor substrate of the first conductivity type, and
the step of forming the power device in the active area further comprising a step of forming a trench MOSFETs in the active area.
3. The method of claim 1 wherein:
the step of forming a plurality of the laterally cascaded MOSFETs in the termination area further comprising a step of forming a plurality of laterally cascaded P-channel MOSFETs in the termination area by forming the dopant floating guard rings (FGRs) of the second conductivity type as P-type doped FGRs and electrically connecting the gate of each of the P-channel MOSFET to one of the heavy dopant regions of the P-type conductivity type encompassed in one of the P-doped FGRs functioning as a drain region of the laterally cascaded P-channel MOSFETs.
4. The method of claim 1 further comprising:
forming the semiconductor layer of the first conductivity type on top of a semiconductor substrate of the second conductivity type, and the step of forming the power device in the active area further comprising a step of forming an IGBT in the active area.
5. The method of claim 1 wherein:
the step of forming a plurality of the dopant floating guard rings (FGRs) of the second conductivity type further comprising forming the FGRs having a distance ranging from 1 to 10 microns between two adjacent FGRs and a depth into the semiconductor layer ranging from 0.5 to 8 microns.
6. The method of claim 1 further comprising:
forming a first field plate comprising a first conductive plate on a top surface adjacent to one of the FGRs closest to an edge of the semiconductor layer and electrically connecting the first field plate to the heavy dopant region encompassed in one of the FGRs closest to the edge of the semiconductor layer.
7. The method of claim 6 further comprising:
forming a channel stop region by implanting a dopant of the first conductivity type into a region immediately next to the edge of the semiconductor layer and forming a second field plate comprising a second conductive plate on the top surface adjacent to the channel stop region and electrically connecting the second field plate to the channel stop region.
8. The method of claim 7 further comprising:
forming an insulation layer extending over the top surface of the semiconductor layer between the first field plate and the second field plate to electrically insulate the first field plate from the second field plate.