Modular nano and microscale sensors
Exemplary embodiments of the present invention disclose a modular testing assay. According to various embodiments of the present invention, the sensor arrays, or microplates, are removably attached to a substrate. In some embodiments, the electrical connection between the sensors of the sensor array and the substrate provide for the removal of one sensor array or microplate with another or similar sensor array. The sensor arrays can be aligned using various types of alignment devices or the substrate can be configured to allow various alignments and spatial orientations of one or more sensor arrays.
1. An assay apparatus for sensing at least one characteristic of a target, comprising:
a plurality of electronic microplates comprising a plurality of sensors;
an electronics layer for communicating with an output device; and
one or more interconnects configured to communicatively connect one or more of the plurality of sensors with the electronics layer,
wherein the plurality of electronic microplates are interchangeably attachable to and detachable from the electronics layer via the one or more interconnects.
2. The assay of claim 1 , wherein at least one sensor of the plurality of sensors is a silicon nanowire array.
3. The assay of claim 1 , wherein the plurality of sensors are sensors for detecting one or more of a mass, a charge, a biological measurement, or combinations thereof of the target.
4. The assay of claim 1 , wherein at least one of the plurality of sensors detect more than one characteristic of the target.
5. The assay of claim 1 , wherein at least one of the plurality of sensors is interchangeable with at least one of another of the plurality of sensors.
6. The assay of claim 1 , wherein the one or more interconnects comprise at least one of electrical leads, electrical pads, a ball grid array, optical interconnects, wireless interconnects, and fluidic interconnects.
7. The assay of claim 1 , wherein:
the one or more interconnects comprise magnetic interconnects configured to electromagnetically connect one or more of the plurality of sensors with the electronics layer; and
the plurality of electronic microplates are interchangeably attachable to and detachable from the electronic layer via the magnetic interconnects.
8. The assay of claim 1 , wherein the one or more interconnects comprise at least one optical interconnect including a waveguide and configured to optically connect one or more of the plurality of sensors with the electronics layer.
9. The assay of claim 1 , further comprising an alignment device that aligns at least one of the plurality of microplates in relation to the electronics layer.
10. The assay of claim 9 , wherein the alignment device is one or more of a barrier, well, alignment pin, or combinations thereof.
11. A measurement system for measuring at least one characteristic of a target, comprising:
an assay apparatus comprising:
an electronics layer;
a plurality of sensor arrays comprising a plurality of sensors; and
one or more interconnects configured to communicatively connect one or more of the plurality of sensors with the electronics layer, wherein the plurality of sensors of the plurality of sensor arrays are interchangeably attachable to and detachable from the electronics layer via the one or more interconnects; and
a detector device communicatively connected to the electronics layer that determines a type of sensor of at least one of the plurality of sensors.
12. The system of claim 11 , wherein at least one of the plurality of sensors detect one or more of a mass, a charge, a biological measurement, or combinations thereof of the target.
13. The system of claim 11 , wherein at least one of the plurality of sensor arrays detect more than one component characteristic of the target.
14. The system of claim 11 , wherein at least one of the plurality of sensors is interchangeable with at least one of another of the plurality of sensors.
15. The system of claim 11 , wherein the detector device comprises a sensor that detects when a sensor of the plurality of sensors is installed or removed on the electronics microplate.
16. The system of claim 11 , further comprising a heating element that controls a temperature of at least a portion of the electronics layer.
17. The system of claim 11 , wherein the detector device is configured according to a type of sensor installed.
18. The system of claim 11 , wherein at least one sensor of the plurality of sensors is a silicon nanowire array.
19. The system of claim 11 , wherein the one or more interconnects comprise at least one of electrical leads, electrical pads, a ball grid array, optical interconnects, wireless interconnects, and fluidic interconnects.
20. The system of claim 11 , wherein:
the one or more interconnects comprise magnetic interconnects configured to electromagnetically connect one or more of the plurality of sensors with the electronics layer; and
the plurality of sensors are interchangeably attachable to and detachable from the electronic layer via the magnetic interconnects.