IP Library › Granted Patent US 8,809,747
Granted Patent B2
US 8,809,747 · App. 13/446,335 · Granted Aug 19, 2014

Current peak spreading schemes for multiplexed heated array

Inventors: John Pease (San Mateo, CA); Neil Benjamin (East Palo Alto, CA)
Assignee: Lam Research Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,809,747
App. No.
13/446,335
Granted
Aug 19, 2014
Kind
B2
Abstract

A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.

Claims (57)

1. A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate includes a first electrically insulating layer, M electrically conductive power supply lines, N electrically conductive power return lines, an array of multiple planar heater zones wherein a respective planar heater zone Z ij is connected to an i-th power supply line and a j-th power return line wherein 1≦i≦M, 1≦j≦N, i and j are integers, and the planar heater zone Z ij comprises one or more heater elements, and a diode serially connected to planar heater zone Z ij between the i-th power supply line and the j-th power return line such that the diode does not allow reverse electrical current flow in a direction from the j-th power return line through the planar heater zone Z ij to the i-th power supply line, and wherein the planar heater zones are laterally distributed across the first electrically insulating layer and operable to tune a spatial temperature profile on the semiconductor substrate, and wherein no two planar heater zones are connected to the same pair of i-th power supply line and j-th power return line; the method comprising:

(a) calculating a time duration T ij for planar heater zone Z ij in the array of multiple heater zones, based on a difference between an actual temperature or an estimated temperature and a setpoint temperature of the planar heater zone Z ij , such that the planar heater zone Z ij reaches its setpoint temperature after being powered by a power supply for the time duration T ij ,

(b) maintaining a connection between the i-th power supply line and the power supply for a controller time duration T i ; and

(c) during the controller time duration T i , powering the planar heater zone Z ij connected to the i-th power supply line by maintaining a connection between the j-th power return line and an electrical ground for the heater zone time duration τ ij ;

(d) repeating step (c) for all integer values of j wherein 1≦j≦N such that not all time durations T ij begin at the same time;

(e) repeating steps (c) and (d) for all integer values of i wherein 1≦i≦M.

2. The method of claim 1 , wherein N is an integer between 2and 100inclusive, and M is an integer between 2 and 100 inclusive.

3. The method of claim 1 , wherein

∑

j

=

1

N

⁢

⁢

τ

ij

≤

T

i

,

and wherein step (d) further comprises, powering each planar heater zone Z ij connected to the i-th power supply line sequentially such that no more than one of planar heater zones Z ij is powered at any given time during T i .

4. The method of claim 1 , wherein

∑

j

=

1

N

⁢

⁢

τ

ij

>

T

i

,

and the time duration τ ij begins at time point α ij and ends at time point β ij relative to the beginning of the time duration T i , in step (d), determining α ij and β ij according to the following rules:

(i) α i1 =0; (ii) α i(j+1) =β ij and β i(j+1) =(α i(j+1) +τ i(j+1) ) if (α i(j+1) +τ i(j+1) )≦T i ; (iii) spliting T i(j+1) into one duration between α i(j+1) and T i and another duration between 0 and (α i(j+1) +τ i(j+1) −T i ) if (α i(j+1) +τ i(j+1) )≦T i .

5. The method of claim 1 , wherein step (d) further comprises moving one or more τ ij from one duration T i to a next duration T i .

6. The method of claim 1 , wherein in step (c) further comprises adjusting T i such that

T

i

=

∑

j

=

1

N

⁢

⁢

τ

ij

and wherein step (d) further comprises powering each planar heater zone Z ij connected to the i-th power supply line sequentially such that one and only one of the planar heater zones Z ij is powered at any given time during T i .

7. The method of claim 1 , wherein the estimated temperature of the heater zone Z ij is calculated in a model based fashion based on real time feedback of the heater zone Z ij .

8. The method of claim 1 , wherein the estimated temperature of the heater zone Z ij is based on previously measured calibration data.

9. The method of claim 1 , wherein the estimated temperature of the heater zone Z ij is calculated in an interpolated fashion based on a result of a model derived from prior calibrations so that the calculation of the time duration T ij for the each heater zone Z ij takes feed forward effects of prior substrate treatment processes into consideration.

10. The method of claim 1 , wherein the estimated temperature of the heater zone Z ij is calculated in an interpolated fashion based on a result of a model derived from prior calibrations so that the calculation of the time duration T ij for the each heater zone Z ij takes feed forward effects of subsequent substrate treatment processes into consideration.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2012
From: PEASE, JOHN; BENJAMIN, NEIL
To: LAM RESEARCH CORPORATION
Reel/Frame 028043/0046 →
Continuity (1)
Related Publication 20130270250A1 · Oct 17, 2013