IP Library › Granted Patent US 8,819,929
Granted Patent B2
US 8,819,929 · App. 12/617,058 · Granted Sep 2, 2014

Component mounting method

Inventor: Kazuhiko Noda (Fukuoka, JP)
Assignee: Panasonic Corporation
H01L21/67144
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Quick Facts
Patent No.
US 8,819,929
App. No.
12/617,058
Granted
Sep 2, 2014
Kind
B2
Abstract

A component mounting method for mounting a plurality of types of components on a substrate is disclosed. The mounting method includes providing a component mounting apparatus 1 for mounting a semiconductor chip 6 a picked from a component feeding stage 3 to a substrate 7 , having a paste coating unit 20 for squirting paste from an associated coating nozzle to apply the paste to the substrate 7 , a paste transfer unit 54 for transferring paste by an associated transfer tool to the substrate 7 , and a heating-press unit 57 for pressing the component loaded on the substrate 7 against the substrate 7 while heating the component. The mounting method also includes selecting a work unit from the paste coating unit 20 , the paste transfer unit 54 and the heating-press unit 57 , and equipping a second head 12 with the selected work unit.

Claims (4)

1. A component mounting method for mounting a plurality of types of components on a substrate, said method comprising:

providing a component mounting apparatus comprising a component feeding stage supplying a component; a substrate holding stage holding a substrate; a first head that receives the component fed from the component feeding stage and that loads the component on a substrate held by the substrate holding stage; a second head that subjects the substrate or the component loaded on the substrate by the first head to a predetermined operation; a common head movement mechanism that moves the first head and the second head so as to alternately make access to a work position on the substrate; a paste coating unit for squirting paste from an associated coating nozzle to apply the paste to the substrate; a paste transfer unit for transferring paste by an associated transfer tool to the substrate; and a heating-press unit for pressing the component loaded on the substrate against the substrate while heating the component,

selecting a work unit from the paste coating unit, the paste transfer unit and the heating-press unit in accordance with the type of a component to be mounted on the substrate, and

equipping the second head with the selected work unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2009
From: NODA, KAZUHIKO
To: PANASONIC CORPORATION
Reel/Frame 023714/0373 →
Priority Claims (1)
JP P2008-296350 · Nov 20, 2008 · national
Continuity (1)
Related Publication 20100122455A1 · May 20, 2010