Compliant core peripheral lead semiconductor socket
An electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of first conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the first conductive traces into the openings. Vias extending through the substrate are electrically coupled the first conductive traces. A plurality of second conductive traces extend along the second surface of the substrate and are electrically coupled to a vias. The second conductive traces are configured to electrical couple with the contact pads on the PCB.
1. A electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB), the electrical interconnect comprising:
a substrate comprising a first surface with a plurality of openings arranged to correspond to the terminals on the IC device;
a compliant material located in the openings;
a plurality of first conductive traces extending along the first surface of the substrate and onto the compliant material, the compliant material providing a biasing force that resists flexure of the first conductive traces into the openings;
vias extending through the substrate are electrically coupled the first conductive traces; and
a plurality of second conductive traces extending along the second surface of the substrate and electrically coupled to a vias, the second conductive traces configured to electrical couple with the contact pads on the PCB.
2. The electrical interconnect of claim 1 comprising first conductive structures electrically coupled to the first conductive traces and positioned over the openings, the first conductive structures configured to enhance electrical coupling with the terminals on the IC device.
3. The electrical interconnect of claim 2 comprising at least one dielectric layer selectively located on the first surface of the substrate to cover the conductive traces, while leaving the first conductive structures exposed.
4. The electrical interconnect of claim 1 wherein the openings extend through the substrate to a second surface.
5. The electrical interconnect of claim 1 wherein the second conductive traces extend onto a compliant material to provide a biasing force that resists flexure of the second conductive traces when compressively engaged with the contact pads on the printed circuit board.
6. The electrical interconnect of claim 1 comprising second conductive structures electrically coupled to the second conductive traces that enhance electrical coupling with the contact pads on the PCB.
7. The electrical interconnect of claim 1 wherein at least one of the first or second conductive traces comprise discrete structures attached to the substrate.
8. The electrical interconnect of claim 1 wherein the first conductive traces are soldered to the terminals on the IC device.
9. The electrical interconnect of claim 1 where in the substrate comprises at least one additional circuitry plane, the additional circuitry plane selected from one of a ground plane, a power plane, an electrical connection to other circuit members, a dielectric layer, or a flexible circuit.
10. The electrical interconnect of claim 1 comprising at least one printed electrical device located on the substrate and electrically coupled to at least a one of the first or second conductive traces, wherein the electrical device is selected from one of shielding, near device decoupling, capacitors, transistors, resistors, filters, signal or power altering and enhancing devices, memory devices, embedded IC devices, RF antennae, and the like.
11. An electrical interconnect assembly comprising:
a housing that retains the electrical interconnect of claim 1 ;
the IC device located in the housing so the terminals on the IC device are electrically coupled to the first conductive traces; and
terminals on the printed circuit board soldered to the second conductive traces located at the second surface of the substrate.
12. A method of making an electrical interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB), the method comprising the steps of:
forming a plurality of openings in a first surface of a substrate at locations corresponding to the terminals on the IC device;
locating a compliant material in the openings;
locating a plurality of first conductive traces on the first surface that extend onto the compliant material, the compliant material providing a biasing force that resists flexure of the first conductive traces into the openings;
forming vias extending through the substrate electrically coupled the first conductive traces; and
forming a plurality of second conductive traces extending along the second surface of the substrate electrically coupled to a vias, the second conductive traces configured to electrical couple with the contact pads on the PCB.
13. The method of claim 12 comprising forming first conductive structures electrically coupled to the first conductive traces and positioned over the openings, the first conductive structures configured to enhance electrical coupling with the terminals on the IC device.
14. The method of claim 13 comprising depositing at least one dielectric layer selectively on the first surface of the substrate to cover the first conductive traces, while leaving the first conductive structures exposed.
15. The method of claim 12 comprising forming the second conductive traces on a compliant material to provide a biasing force that resists flexure of the second conductive traces when compressively engaged with the contact pads on the printed circuit board.
16. The method of claim 12 comprising forming second conductive structures electrically coupled to the second conductive traces that enhance electrical coupling with the contact pads on the PCB.
17. The method of claim 12 comprising the steps of:
forming at least one of the first or second conductive traces as discrete structures; and
attaching the discrete structures to the substrate.
18. A method of making an electrical interconnect assembly comprising the steps of:
locating the electrical interconnect of claim 12 in a housing;
positioning the IC device in the housing to electrically couple the terminals on the IC device to the first conductive traces; and
soldering the contact pads on the PCB to the second conductive traces on the second surface of the substrate.
19. A method of making an electrical interconnect assembly comprising the steps of:
locating the electrical interconnect of claim 12 in a housing;
positioning the IC device in the housing to electrically couple the terminals on the IC device to the first conductive traces; and
biasing the IC device against the first surface of the substrate to flex the first conductive traces into the openings against the resistance of the compliant material.
20. A method of making an electrical interconnect assembly comprising the steps of:
locating the electrical interconnect of claim 12 in a housing;
electrically coupling the contact pads on the PCB with the second conductive traces on the second surface of the substrate; and
biasing the PCB against the second surface of the substrate to flex the second conductive traces into the openings against the resistance of the compliant material.