Adhesion type area sensor and display device having adhesion type area sensor

1. A semiconductor device comprising a pixel, the pixel comprising:

a first thin film transistor comprising a semiconductor layer, with a first insulating film over the semiconductor layer, and a gate over the semiconductor layer with the first insulating film therebetween;

a photodiode comprising a photoelectric conversion layer;

a sensor output wiring and a sensor electric power source line; and

a second insulating film over the gate of the first thin film transistor;

wherein the first insulating film is disposed over the photoelectric conversion layer,

wherein the pixel is configured to irradiate the photoelectric conversion layer with light reflected by a subject,

wherein a first terminal of the first thin film transistor is electrically connected to the sensor output wiring,

wherein a second terminal of the first thin film transistor is electrically connected to the sensor electric power source line,

wherein the gate of the first thin film transistor is electrically connected to a first terminal of the photodiode,

wherein the semiconductor layer and the photoelectric conversion layer are on a same surface, and

wherein the second insulating film is in contact with the first insulating film over the photoelectric conversion layer.

2. The semiconductor device according to claim 1 , wherein the light is emitted from a light emitting layer and reflected by the subject.

3. The semiconductor device according to claim 1 , wherein each of the semiconductor layer and the photoelectric conversion layer comprises crystalline silicon.

4. The semiconductor device according to claim 1 , wherein the semiconductor layer and the photoelectric conversion layer are formed over a glass substrate.

5. A semiconductor device comprising a pixel, the pixel comprising:

a first thin film transistor comprising a first semiconductor layer, with a first insulating film over the first semiconductor layer, and a gate over the first semiconductor layer with the first insulating film therebetween;

a photodiode comprising a photoelectric conversion layer;

a sensor output wiring and a sensor electric power source line;

a second insulating film over the gate of the first thin film transistor;

a second thin film transistor comprising a second semiconductor layer; and

a pixel electrode electrically connected to the second thin film transistor,

wherein the first insulating film is disposed over the photoelectric conversion layer,

wherein the pixel is configured to irradiate the photoelectric conversion layer with light reflected by a subject,

wherein a first terminal of the first thin film transistor is electrically connected to the sensor output wiring,

wherein a second terminal of the first thin film transistor is electrically connected to the sensor electric power source line,

wherein the gate of the first thin film transistor is electrically connected to a first terminal of the photodiode,

wherein the first semiconductor layer, the second semiconductor layer and the photoelectric conversion layer are on a same surface, and

wherein the second insulating film is in contact with the first insulating film over the photoelectric conversion layer.

6. The semiconductor device according to claim 5 , wherein the semiconductor device is a light emitting display device.

7. The semiconductor device according to claim 5 , further comprising a light emitting layer electrically connected to the pixel electrode.

8. The semiconductor device according to claim 7 , wherein the light is emitted from the light emitting layer.

9. The semiconductor device according to claim 5 , wherein each of the first semiconductor layer, the second semiconductor layer, and the photoelectric conversion layer comprises crystalline silicon.

10. The semiconductor device according to claim 5 , wherein the first semiconductor layer, the second semiconductor layer, and the photoelectric conversion layer are formed over a glass substrate.

11. A semiconductor device comprising a pixel, the pixel comprising:

a first thin film transistor comprising a semiconductor layer, with a first insulating film over the semiconductor layer, and a gate over the semiconductor layer with the first insulating film therebetween;

a photodiode comprising a photoelectric conversion layer, with the first insulating film over the photoelectric conversion layer, and a gate over the photoelectric conversion layer with the first insulating film therebetween;

a sensor output wiring and a sensor electric power source line; and

a second insulating film over the gate of the first thin film transistor and the gate of the photodiode;

wherein the pixel is configured to irradiate the photoelectric conversion layer with light reflected by a subject,

wherein a first terminal of the first thin film transistor is electrically connected to the sensor output wiring,

wherein a second terminal of the first thin film transistor is electrically connected to the sensor electric power source line,

wherein the gate of the first thin film transistor is electrically connected to a first terminal of the photodiode, and

wherein the semiconductor layer and the photoelectric conversion layer are on a same surface.

12. The semiconductor device according to claim 11 , wherein the semiconductor device is a light emitting display device.

13. The semiconductor device according to claim 11 , wherein each of the semiconductor layer and the photoelectric conversion layer comprises crystalline silicon.

14. The semiconductor device according to claim 11 , wherein the semiconductor layer and the photoelectric conversion layer are formed over a glass substrate.

15. The semiconductor device according to claim 11 , further comprising a pixel electrode and a light emitting layer electrically connected to the pixel electrode.

16. The semiconductor device according to claim 15 , wherein the light is emitted from the light emitting layer.