Interposer-embedded printed circuit board
Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.
1. An interposer-embedded printed circuit board, comprising:
a substrate which is a printed circuit board having an insulating resin thereon, the insulating resin including a cavity formed in the top side thereof and having a predetermined height in a thickness direction of the substrate;
an interposer disposed in the cavity and including a wiring region and an insulating region;
a circuit layer formed in the printed circuit board and including a connection pattern connected with the wiring region of the bottom side of the interposer; and
a bump formed on the wiring region of the top side of the interposer to connect a semiconductor chip with the interposer,
wherein the top side of the interposer is flush with the top side of the substrate,
wherein the wiring region of the interposer is directly attached to the bump, and
wherein substrate is corn used of an insulation material and the material of the insulating region in the interposer has higher mechanical strength than the insulation material of the substrate.
2. The interposer-embedded printed circuit board according to claim 1 , wherein the interposer is disposed in the cavity such that the top side of the interposer is exposed.
3. The interposer-embedded printed circuit board according to claim 1 , wherein a passive component is embedded in the top side of the interposer.
4. The interposer-embedded printed circuit board according to claim 1 , wherein a passive component is embedded in the bottom side of the interposer.
5. The interposer-embedded printed circuit board according to claim 1 , wherein the poser s composed of silicon.
6. The interposer-embedded printed circuit board according to claim 1 , herein the circuit layer includes pads, the pads being exposed to the bottom side of the substrate and providing thereon with solder balls for connecting the circuit layer with external circuits.
7. The interposer-embedded printed circuit board according to claim 1 , wherein the interposer is directly attached to the bottom side of the cavity on the substrate.