Solid-state image sensor
According to embodiments of the present invention, a solid-state image sensor has a semiconductor element substrate having a plurality of photo electric conversion elements, an interlaminar insulating film having wires, formed at a first surface of the semiconductor element substrate, a color filter having a plurality of dye films of a plurality of colors, formed at a second surface of the semiconductor element substrate, a micro lens array having a plurality of micro lenses, formed above the color filter, a plurality of inner lenses formed between the photoelectric conversion elements and the dye films, and a shroud that surrounds each of the inner lenses, formed above the second surface of the semiconductor element substrate.
1. A solid-state image sensor comprising:
a semiconductor element substrate having a plurality of photo electric conversion elements;
an interlaminar insulating film having wires, formed at a first surface of the semiconductor element substrate;
a color filter having dye films of a plurality of colors, formed at a second surface of the semiconductor element substrate;
a micro lens array having a plurality of micro lenses, formed above the color filter;
a plurality of inner lenses formed between the photoelectric conversion elements and the dye films; and
a shroud that surrounds each of the inner lenses, formed above the second surface of the semiconductor element substrate, wherein
the shroud is comprised of SiGe, and
the semiconductor substrate is a silicon substrate.
2. The solid-state image sensor according to claim 1 , wherein a thickness of the shroud is thinner than a thickness of the inner lens.
3. The solid-state image sensor according to claim 2 , further comprising:
a spacer that is formed on the shroud so that the upper surface of the spacer is in the same level as the upper surface of the inner lens.
4. The solid-state image sensor according to claim 1 , wherein
an upper width of the shroud is narrower than a lower width of the shroud.
5. The solid-state image sensor according to claim 4 , wherein a lateral side of the shroud has a tapered shape.
6. The solid-state image sensor according to claim 4 , wherein the shroud has a lower part and an upper part that has a narrower width than the lower part, and
a lateral side of the shroud has a stepwise shape.
7. The solid-state image sensor according to claim 4 , wherein the semiconductor element substrate further has a plurality of semiconductor elements that control the photo electric conversion elements, and the shroud is formed between the semiconductor elements and the color filter.
8. The solid-state image sensor according to claim 1 , further comprising:
a plurality of interlayers that are formed between each of the inner lenses and the shroud.
9. The solid state image sensor of claim 1 , further including:
a lens unit configured to direct light passing therethrough onto the image sensor;
a processor configured to process signals that are output from the image sensor and output image data;
a memory configured to store the image data output from the processor;
a display configured to display an image corresponding to the image data output from the processor and the memory; and
a controller configured to control the image sensor, the lens unit, the processor, the memory, and the display.
10. A manufacturing method of a solid state image sensor comprising:
forming a semiconductor element substrate having a plurality of photo electric conversion elements;
forming an interlaminar insulating film having wires, at a first surface of the semiconductor element substrate;
forming a color filter having dye films of a plurality of colors, at a second surface of the semiconductor element substrate;
forming a micro lens array having a plurality of micro lenses, above the color filter;
forming a plurality of inner lenses between the photoelectric conversion elements and the dye films; and
forming a shroud that surrounds each of the inner lenses, above the second surface of the semiconductor element substrate, wherein
the shroud is comprised of SiGe, and
the semiconductor substrate is a silicon substrate.
11. The manufacturing method according to claim 10 , wherein
a thickness of the shroud is formed thinner than a thickness of the inner lens.
12. The manufacturing method according to claim 10 , wherein
an upper width of the shroud is formed to be narrower than a lower width of the shroud.
13. The manufacturing method according to claim 12 , wherein the shroud is formed by a selective epitaxial growth method.
14. The manufacturing method according to claim 13 , further comprising:
forming a layer configured to prevent a growth of a crystal that constitutes the shroud, on regions on which the inner lenses are to be formed.
15. A solid-state image sensor comprising:
a semiconductor element substrate having a plurality of photo electric conversion elements;
an interlaminar insulating film having wires, formed at a first surface of the semiconductor element substrate;
a color filter having dye films of a plurality of colors, formed at a second surface of the semiconductor element substrate;
a micro lens array having a plurality of micro lenses, formed above the color filter;
a plurality of inner lenses formed between the photoelectric conversion elements and the dye films; and
a shroud that prevents a light that passes through the dye film corresponding to one of the photo electric conversion elements from entering onto another one of the photo electric conversion elements, formed above the second surface of the semiconductor element substrate,
the shroud is comprised of SiGe, and
the semiconductor substrate is a silicon substrate.
16. The solid-state image sensor according to claim 15 , wherein a thickness of the shroud is thinner than a thickness of the inner lens.
17. The solid-state image sensor according to claim 15 , further comprising:
a spacer that is formed on the shroud so that the upper surface of the spacer is in the same level as the upper surface of the inner lens.
18. The solid-state image sensor according to claim 15 , wherein
an upper width of the shroud is narrower than a lower width of the shroud.