Thin image capturing apparatus

1. A thin image capturing apparatus, comprising:

a circuit substrate, having at least one electronic component installed thereon and electrically coupled by a circuit, and a hole formed in the circuit substrate; and a light sensing element, embedded into the hole of the circuit substrate, and having a sensing surface,

wherein the light sensing element is a backside illumination sensor, and a plurality of solder pads are installed on an opposite side of the sensing surface, and the circuit substrate includes a plurality of corresponding solder pads, and each corresponding solder pad is coupled between the circuit substrate and the light sensing element by an electrically conductive wire for an electric connection,

the hole of the circuit substrate is step shaped with different areas of upper and lower ends of the hole, the hole at a greater area is capable of containing the light sensing element, and the hole at a smaller area is smaller than the size of the light sensing element and greater than the sensing area of the light sensing element, and the sensing surface of the light sensing element is attached onto a plane formed by the step shape inside the circuit substrate hole by an adhesive layer.

2. The thin image capturing apparatus of claim 1 , wherein the adhesive layer is made of an adhesive material which is an electrically conductive adhesive.

3. The thin image capturing apparatus of claim 1 , wherein the circuit substrate includes a translucent plate attached thereon, and the area of the translucent plate is capable of sealing an end of the hole, and the sensing surface of the light sensing element is at least attached onto the periphery of the translucent plate by an adhesive layer.

4. The thin image capturing apparatus of claim 3 , wherein the adhesive layer is made of an adhesive material which is an electrically conductive adhesive.