IP Library › Granted Patent US 8,847,268
Granted Patent B2
US 8,847,268 · App. 13/014,390 · Granted Sep 30, 2014

Light emitting device and light emitting device package

Inventors: Kwang Ki Choi (Seoul, KR); Hwan Hee Jeong (Seoul, KR); Sang Youl Lee (Seoul, KR); June O Song (Seoul, KR); Ji Hyung Moon (Seoul, KR)
Assignee: LG Innotek Co., Ltd.
H01L33/40H01L33/42H01L33/36H01L33/22H01L33/10H01L33/44
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Quick Facts
Patent No.
US 8,847,268
App. No.
13/014,390
Granted
Sep 30, 2014
Kind
B2
Abstract

Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

Claims (41)

1. A light emitting device, comprising:

a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer;

an oxide layer on a top surface of the first conductive semiconductor layer;

a first electrode on a top surface of the first conductive semiconductor layer;

a second electrode on the second conductive semiconductor layer; and

a transmissive electrode layer on a top surface of the second conductive semiconductor layer, wherein the second electrode passes through the transmissive electrode layer, wherein the oxide layer extends from the top surface of the first conductive semiconductor layer to a portion of the top surface of the second conductive semiconductor layer along a lateral surface of the light emitting structure, wherein the second electrode comprises an upper portion and a lower portion under the upper portion, wherein the upper portion of the second electrode is wider than the lower portion of the second electrode, and wherein the upper portion of the second electrode is thicker than the lower portion of the second electrode.

2. The light emitting device of claim 1 , wherein a bottom surface of the first electrode contacting the top surface of the first conductive semiconductor layer has an area of about 10% to about 95% of a top surface of the first electrode.

3. The light emitting device of claim 1 , wherein an overlap region vertically between the first electrode and the oxide layer has a width of about 5% to about 90% of a top surface of the first electrode.

4. The light emitting device of claim 1 , wherein the oxide layer includes at least one of a transmissive conductive material or a transmissive insulating material.

5. The light emitting device of claim 1 , wherein the oxide layer includes at least one selected from the group consisting of SiO x , SiO x N y , TiO 2 , Al 2 O 3 , ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrO x , and RuO x .

6. The light emitting device of claim 1 , wherein the oxide layer includes:

a first layer including a transmissive insulating material on the top surface of the first conductive semiconductor layer; and

a second layer including a transmissive conductive material on the first layer.

7. The light emitting device of claim 1 , wherein the oxide layer includes:

a first layer having a high refractive index on the top surface of the first conductive semiconductor layer; and

a second layer having a low refractive index on the first layer.

8. The light emitting device of one of claim 1 , further comprising a concave-convex structure in the oxide layer.

9. The light emitting device of claim 1 , wherein the oxide layer is disposed on the top surface of the first conductive semiconductor layer and a lateral surface of the first conductive semiconductor layer, a lateral surface of the active layer, and a lateral surface of the second conductive semiconductor layer and the top surface of the second conductive semiconductor layer.

10. The light emitting device of claim 9 , wherein the transmissive electrode layer is spaced apart from one end of the oxide layer on the top surface of the second conductive semiconductor layer.

11. The light emitting device of claim 1 , wherein the oxide layer comprises a first portion that extends to the top surface of the second conductive semiconductor layer and a second portion provided between the transmissive electrode layer and the second conductive semiconductor layer.

12. The light emitting device of claim 11 , wherein the first portion of the insulating layer overlaps with the transmissive electrode layer.

13. The light emitting device of claim 1 , wherein the oxide layer extends to a top surface of the transmissive electrode layer.

14. The light emitting device of claim 1 , wherein the first electrode includes at least one of Au, Al, Ag, Ti, Cu, Ni, or Cr.

15. The light emitting device of claim 1 , further comprising a first concave-convex structure and a second concave-convex structure on a top surface and a bottom surface of the oxide layer, respectively.

16. The light emitting device of claim 1 , wherein the first electrode passes through the oxide layer while overlapping with the oxide layer in a vertical direction.

17. The light emitting device of claim 1 , wherein the oxide layer is disposed only on the top surface of the first conducive semiconductor layer.

18. A light emitting device, comprising:

a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer;

an oxide layer on a top surface of the first conductive semiconductor layer;

a first electrode on a top surface of the first conductive semiconductor layer;

a second electrode on the second conductive semiconductor layer and passing through an electrode layer; and

the electrode layer on a top surface of the second conductive semiconductor layer, wherein the oxide layer is disposed on at least a portion of a top surface of the electrode layer, wherein a first portion of the oxide layer extends to the top surface of the second conductive semiconductor layer, and wherein a second portion of the oxide layer is provided between the second conductive semiconductor layer and the electrode layer.

19. The light emitting device of claim 18 , wherein the electrode layer has an open structure, and wherein the second electrode has a side surface contacting an inner side surface of the open structure.

20. The light emitting device of claim 19 , wherein the second electrode has a first bottom surface contacting at least a portion of the electrode layer and a second bottom surface contacting at least a portion of the second conductive semiconductor layer through the open structure.

21. The light emitting device of claim 18 , wherein the first portion of the insulating layer overlaps with the electrode layer.

22. A light emitting device, comprising:

a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer;

an oxide layer on a top surface of the first conductive semiconductor layer;

a first electrode on a top surface of the first conductive semiconductor;

a second electrode on the second conductive semiconductor layer; and

a transmissive electrode layer on a top surface of the second conductive semiconductor layer, wherein the second electrode passes through the transmissive electrode layer, and wherein the oxide layer is disposed on the top surface and a lateral surface of the first conductive semiconductor layer, a lateral surface of the active layer, and a lateral surface and the top surface of the second conductive semiconductor layer, wherein the second electrode comprises an upper portion and a lower portion under the upper portion, wherein the upper portion of the second electrode is wider than the lower portion of the second electrode, and wherein the upper portion of the second electrode is thicker than the lower portion of the second electrode.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2023
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: WANGS ALLIANCE CORPORATION
Reel/Frame 063075/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2011
From: CHOI, KWANG KI; JEONG, HWAN HEE; LEE, SANG YOUL; SONG, JUNE O; MOON, JI HYUNG
To: LG INNOTEK CO., LTD.
Reel/Frame 025702/0037 →
Priority Claims (1)
KR 10-2010-0022754 · Mar 15, 2010 · national
Continuity (1)
Related Publication 20110220942A1 · Sep 15, 2011