Surface-mountable magnetic field sensor having a semiconductor chip and method for producing a circuit board having a magnetic field sensor

1. A surface-mountable magnetic field sensor comprising:

a semiconductor chip on a flat-conductor substrate, and

at least three flat-conductor electrodes protruding from a plastic housing,

wherein the semiconductor chip and the flat-conductor substrate are embedded into the plastic housing,

wherein the plastic housing can be inserted with the embedded semiconductor chip into a magnetic field gap, with the flat-conductor electrodes protruding, and

wherein each of the at least three flat-conductor electrodes has a protruding portion protruding from a plastic housing, a lateral portion extending laterally to the protruding portion, and a bent section connecting the lateral portion and protruding portion,

wherein the bent sections of the flat-conductor electrodes are arranged in a plastic holder, and the lateral portions of the flat-conductor electrodes extend from the plastic holder in different directions, and

wherein the lateral sections of the flat-conductor electrodes are surface-mountable on a circuit board when the plastic holder is inserted through an opening in the circuit board.

2. The magnetic field sensor according to claim 1 , wherein the plastic holder has a coding element.

3. The magnetic field sensor according to claim 2 , wherein the plastic holder with the coding element is arranged in a matched opening at an angle with respect to a top side of the circuit board, and wherein the plastic housing projects at said angle from the top side of the circuit board.

4. The magnetic field sensor according to claim 1 , wherein the plastic holder has a smoothed surface region, which is smoothed for picking up the magnetic field sensor by means of a suction pipette.

5. The magnetic field sensor according to claim 4 , wherein the plastic holder has an apron fitted laterally with respect to the surface region, from which apron the bent portions of the flat-conductor electrodes protrude, and wherein the apron has a bead as coding element.

6. The magnetic field sensor according to claim 1 , wherein the magnetic field sensor is a Hall.

7. The magnetic field sensor according to claim 1 , wherein the plastic holder and the plastic housing have an integral encapsulation of the flat-conductor electrodes, of the semiconductor chip and of the flat-conductor substrate.

8. The magnetic field sensor according to claim 1 , wherein the protruding portions of the flat-conductor electrodes extend parallel to each other, and the lateral portions of the flat-conductor electrodes extend in a common plane.

9. A magnetic field measuring device comprising:

a circuit board having an opening, and

a magnetic field sensor comprising:

a semiconductor chip on a flat-conductor substrate, and

at least three flat-conductor electrodes protruding from a plastic housing,

wherein the semiconductor chip and the flat-conductor substrate are embedded into the plastic housing,

wherein the plastic housing can be inserted with the embedded semiconductor chip into a magnetic field gap, with the flat-conductor electrodes protruding, and

wherein each of the at least three flat-conductor electrodes has a protruding portion protruding from a plastic housing, a lateral portion extending laterally to the protruding portion, and a bent section connecting the lateral portion and protruding portion,

wherein the bent sections of the flat-conductor electrodes are arranged in a plastic holder, and the lateral portions of the flat-conductor electrodes extend from the plastic holder in different directions, and

wherein the plastic holder is inserted through the opening in the circuit board, and the lateral sections of the flat-conductor electrodes are surface mounted on the circuit board.

10. The magnetic field measuring device according to claim 9 , wherein the plastic holder has a coding element.

11. The magnetic field measuring device according to claim 10 , wherein the plastic holder with the coding element is arranged in a matched opening at an angle with respect to a top side of the circuit board, and wherein the plastic housing projects at said angle from the top side of the circuit board.

12. The magnetic field measuring device according to claim 9 , wherein the plastic holder has a smoothed surface region, which is smoothed for picking up the magnetic field sensor by means of a suction pipette.

13. The magnetic field measuring device according to claim 12 , wherein the plastic holder has an apron fitted laterally with respect to the surface region, from which apron the lateral portions of the flat-conductor electrodes protrude, and wherein the apron has a bead as coding element.

14. The magnetic field measuring device according to claim 9 , wherein the magnetic field sensor is a Hall sensor.

15. The magnetic field measuring device according to claim 9 , wherein the plastic holder and the plastic housing have an integral encapsulation of the flat-conductor electrodes, of the semiconductor chip and of the flat-conductor substrate.

16. The magnetic field measuring device of claim 9 , wherein the protruding portions of the flat-conductor electrodes of the magnetic field sensor extend parallel to each other, and the lateral portions of the flat-conductor electrodes extend in a common plane.

17. A method for producing and populating a circuit board with a magnetic field sensor, comprising the following method steps:

bending flat-conductor electrodes of the magnetic field sensor which protrude from a plastic housing side;

attaching or injection-molding a plastic holder onto or at the bent flat-conductor electrodes;

producing a circuit board, which can be arranged above a magnetic field gap;

introducing an opening into the circuit board, which is matched in terms of contour and size to an apron with a coding element of the magnetic field sensor;

fitting contact areas on the circuit board for the surface mounting of the bent portions of the flat-conductor electrodes; and

introducing the magnetic field sensor into the opening and surface mounting of the magnetic field sensor with cohesive connection of the bent portions of the flat-conductor electrodes on the top side of the circuit board with the contact areas, in such a way that the plastic housing is arranged with a semiconductor sensor chip at a distance from the underside of the circuit board.

18. The method according to claim 17 , wherein the magnetic field sensor is introduced into the opening in the circuit board using an automatic placement machine, wherein a plurality of magnetic field sensors are arranged on a tray and columns and are fed to the automatic placement machine.

19. The method according to claim 18 , wherein the magnetic field sensors are lifted from the tray by means of a vacuum pipette sucking up a smoothed surface region of the plastic holder and are fed to a placement position on a circuit board.