IP Library › Granted Patent US 8,852,721
Granted Patent B2
US 8,852,721 · App. 13/013,415 · Granted Oct 7, 2014

Method for cutting tempered glass and preparatory tempered glass structure

Inventors: Jeng-Jye Hung (Tai Chung County, TW); Yi-Te Lee (Kaohsiung, TW); Hen-Ta Kang (Taichung, TW); Chih-Yuan Wang (Tai Chung County, TW)
Assignees: Dongguan Masstop Liquid Crystal Display Co., Ltd.; Wintek Corporation
C03C21/002B32B3/30B24B7/241C03C21/00C03B33/023
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Quick Facts
Patent No.
US 8,852,721
App. No.
13/013,415
Granted
Oct 7, 2014
Kind
B2
Abstract

A preparatory tempered glass structure for a cutting treatment includes a glass substrate and at least one trench. The glass substrate is given a strengthening treatment to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer. The trench is formed in the compression stress layer of the glass substrate and overlaps a predetermined cutting path for the cutting treatment.

Claims (8)

1. A preparatory tempered glass structure for a cutting treatment, comprising:

a glass substrate given a strengthening treatment to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer, wherein the glass substrate has a bottom surface and a top surface opposite the bottom surface;

a first trench formed on the top surface and in the compression stress layer of the glass substrate without splitting the glass substrate to remove a part of the compression stress layer and correspondingly reduce a tensile stress along the first trench;

a second trench formed on the bottom surface and in the compression stress layer of the glass substrate without splitting the glass substrate to remove a part of the compression stress layer and correspondingly reduce a tensile stress along the second trench; and

a scribe line formed in the first trench or the second trench to initiate the cutting treatment and define a cutting path for the cutting treatment.

2. The preparatory tempered glass structure as claimed in claim 1 , wherein the depth of the trench is substantially larger than the thickness of the compression stress layer.

3. The preparatory tempered glass structure as claimed in claim 1 , wherein the glass substrate is given an ion exchange glass strengthening treatment.

4. The preparatory tempered glass structure as claimed in claim 1 , wherein the trench is formed by etching or polishing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2011
From: HUNG, JENG-JYE; LEE, YI-TE; KANG, HEN-TA; WANG, CHIH-YUAN
To: DONGGUAN MASSTOP LIQUID CRYSTAL DISPLAY CO., LTD.; WINTEK CORPORATION
Reel/Frame 025695/0479 →
Priority Claims (2)
TW 99102208 A · Jan 27, 2010 · national
TW 99132711 A · Sep 28, 2010 · national
Continuity (1)
Related Publication 20110183116A1 · Jul 28, 2011