IP Library › Granted Patent US 8,853,599
Granted Patent B2
US 8,853,599 · App. 12/994,051 · Granted Oct 7, 2014

Induction heating cooking apparatus

Inventors: Takaaki Kusaka (Hyogo, JP); Akira Kataoka (Shiga, JP); Kazunori Takechi (Hyogo, JP)
Assignee: Panasonic Corporation
H05B6/1263H05B2213/07H05B6/062
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Quick Facts
Patent No.
US 8,853,599
App. No.
12/994,051
Granted
Oct 7, 2014
Kind
B2
Abstract

An induction heating cooking apparatus includes a magnetic flux-shielding plate 28 to restrain magnetic flux leakage from a heating coil 24 and define a cooling air trunk 33 , through which cooling air from a fan 32 passes. An infrared sensor 26 for detecting infrared rays emitted from a cooking container 22 and a control circuit 27 for controlling an output of a heating coil 24 depending on an output from the infrared sensor 26 are accommodated within the same space with respect to the magnetic flux-shielding plate 28 to thereby enhance assemblage. Also, the infrared sensor 26 is mainly cooled by cooling air passing through a cooling air trunk 33 to thereby enhance the cooling efficiency of the infrared sensor 26 and conduct correct temperature detection.

Claims (19)

1. An induction heating cooking apparatus comprising:

a main body;

a top plate mounted on an upper surface of the main body to place a cooking container thereon;

a heating coil disposed below the top plate to heat the cooking container;

a plurality of ferrite materials disposed below the heating coil so as to extend radially from a center of the heating coil;

a heating coil holding plate holding the heating coil and the ferrite materials;

an infrared sensor disposed below the top plate to detect infrared rays emitted from the cooking container;

a control circuit disposed below the ferrite materials and comprising an inverter circuit operable to generate a high frequency current to be supplied to the heating coil and a semiconductor element operable to drive the inverter circuit, the control circuit controlling an output of the heating coil depending on an output from the infrared sensor;

a heat sink on which the semiconductor element is mounted, wherein the heat sink operable to cool the semiconductor element mounted thereto;

a magnetic flux-shielding plate interposed between the ferrite materials and the control circuit and, the magnetic flux-shielding plate being divided from the heat sink, the magnetic flux-shielding plate that supports the heating coil and the ferrite from below, and the magnetic flux-shielding plate being made of a metal plate to shield magnetic flux leakage downward from the ferrite materials;

a fan operable to convey cooling air to cool the control circuit and the heat sink; and

a duct that leads another flow of the cooling air from the fan toward neighborhood of the infrared sensor;

wherein the infrared sensor is positioned below the magnetic flux-shielding plate, and the fan conveys the cooling air to the heat sink and the another flow of the cooling air to the neighborhood of the infrared sensor below the magnetic flux-shielding plate through the duct.

2. The induction heating cooking apparatus according to claim 1 , further comprising a cylindrical member interposed between the infrared sensor and the top plate so as to extend through the magnetic flux-shielding plate, wherein infrared rays emitted from the cooking container pass through the cylindrical member.

3. The induction heating cooking apparatus according to claim 1 , wherein the infrared sensor and the heat sink is positioned in parallel with respect to the fan such that the cooling air from the fan to the infrared sensor along lower surface of the magnetic flux-shielding plate and the cooling air from the fan to a space between the magnetic flux-shielding plate and the heat sink flow in parallel to each other.

4. The induction heating cooking apparatus according to claim 1 , further comprising a light emitting ring encircling an outer periphery of the heating coil, wherein the top plate comprises a light shielding film formed on a lower surface thereof confronting the heating coil to shield light and a light transmitting portion formed on the lower surface of the top plate to allow transmission of light by removing a portion of the light shielding film at a location confronting the light emitting ring, and wherein the magnetic flux-shielding plate confronts the light transmitting portion.

5. The induction heating cooking apparatus according to claim 4 , further comprising a light absorbing film formed on the magnetic flux-shielding plate.

6. The induction heating cooking apparatus according to claim 1 , further comprising a casing mounted to a lower surface of the heating coil holding plate to accommodate the infrared sensor therein, the casing extending through the magnetic flux-shielding plate.

7. The induction heating cooking apparatus according to claim 6 , further comprising a detection circuit operable to detect an output from the infrared sensor, wherein the casing is formed of a conductive metallic material and held in contact with the detection circuit, but electrically insulated from the magnetic flux-shielding plate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2015
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 036252/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2011
From: KUSAKA, TAKAAKI; KATAOKA, AKIRA; TAKECHI, KAZUNORI
To: PANASONIC CORPORATION
Reel/Frame 025806/0836 →
Priority Claims (2)
JP 2008-137584 · May 27, 2008 · national
JP 2008-139195 · May 28, 2008 · national
Continuity (1)
Related Publication 20110073588A1 · Mar 31, 2011