IP Library › Granted Patent US 8,860,150
Granted Patent B2
US 8,860,150 · App. 12/634,689 · Granted Oct 14, 2014

Metal gate structure

Inventors: Chin-Fu Lin (Tainan, TW); Nien-Ting Ho (Tainan, TW); Chun-Hsien Lin (Tainan County, TW); Chih-Hao Yu (Tainan County, TW); Cheng-Hsien Chou (Tainan, TW)
Assignee: United Microelectronics Corp.
H01L29/66545H01L29/7833H01L29/6659H01L21/28088H01L21/823842H01L29/513H01L29/517H01L29/4966
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Quick Facts
Patent No.
US 8,860,150
App. No.
12/634,689
Granted
Oct 14, 2014
Kind
B2
Abstract

The metal gate structure of the present invention can include a TiN complex, and the N/Ti proportion of the TiN complex is decreased from bottom to top. In one embodiment, the TiN complex can include a single TiN layer, which has an N/Ti proportion gradually decreasing from bottom to top. In another embodiment, the TiN complex can include a plurality of TiN layers stacking together. In such a case, the lowest TiN layer has a higher N/Ti proportion than the adjusted TiN layer.

Claims (14)

1. A metal gate structure, comprising:

a gate dielectric layer; and

a gate electrode, comprising

a first work function metal layer, disposed on the gate dielectric layer; and

a second work function metal layer, disposed on the first work function metal layer;

wherein both the first and the second work function metal layers are substantially composed by a first element and a second element, a ratio of the first element to the second element of the first work function metal layer is different from a ratio of the first element to the second element of the second work function metal layer, a ratio of the second element to the first element decreases along with a thickness of the first work function metal layer or a thickness of the second work function metal layer from bottom to top, and a molecular composition of the first work function metal layer and a molecular composition of the second work function metal layer are not continuous at an interface between the first work function metal layer and the second work function metal layer.

2. The metal gate structure of claim 1 , wherein the first element is titanium, and the second element is nitrogen.

3. The metal gate structure of claim 1 , wherein the first element is tantalum, and the second element is nitrogen.

4. The metal gate structure of claim 1 , wherein a molecular composition of the first work function metal layer is different from a molecular composition of the second work function metal layer.

5. The metal gate structure of claim 1 , wherein a density of the first work function metal layer is different from a density of the second work function metal layer.

6. The metal gate structure of claim 1 , wherein a resistivity of the first work function metal layer is different from a resistivity of the second work function metal layer.

7. The metal gate structure of claim 1 , wherein a preferred crystal orientation of the first work function metal layer is different from a preferred crystal orientation of the second work function metal layer.

8. The metal gate structure of claim 1 , further comprising a cap layer disposed between the first work function metal layer and the gate dielectric layer.

9. The metal gate structure of claim 1 , wherein the first work function metal layer and the second work function metal layer exist on a sidewall of the gate electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2009
From: LIN, CHIN-FU; HO, NIEN-TING; LIN, CHUN-HSIEN; YU, CHIH-HAO; CHOU, CHENG-HSIEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 023631/0853 →
Continuity (1)
Related Publication 20110140207A1 · Jun 16, 2011