IP Library Granted Patent US 8,865,627
Granted Patent B2
US 8,865,627 · App. 14/091,460 · Granted Oct 21, 2014

Method for manufacturing precursor, method for manufacturing superconducting wire, precursor, and superconducting wire

Inventor: Hajime Ota (Osaka, JP)
Assignees: Sumitomo Electric Industries, Ltd.; Toyo Kohan Co., Ltd.
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Quick Facts
Patent No.
US 8,865,627
App. No.
14/091,460
Granted
Oct 21, 2014
Kind
B2
Abstract

A method for manufacturing a superconducting wire includes the following steps. A laminate metal having a first metal layer and a Ni layer formed on the first metal layer is prepared. An intermediate layer ( 20 ) is formed on the Ni layer of the laminate metal. A superconducting layer ( 30 ) is formed on the intermediate layer ( 20 ). By subjecting the laminate metal to a heat treatment after at least either of the step of forming a intermediate layer ( 20 ) and the step of forming a superconducting layer ( 30 ), a nonmagnetic Ni alloy layer ( 12 ) is formed from the laminate metal.

Claims (19)

1. A method for manufacturing a precursor comprising the steps of:

preparing a laminate metal having a first metal layer, and a non-alloyed nickel layer formed on said first metal layer;

forming an intermediate layer on said nickel layer of said laminate metal; and

forming a nonmagnetic nickel alloy layer from said laminate metal by subjecting said laminate metal to a heat treatment after said step of forming an intermediate layer, wherein

in said nonmagnetic nickel alloy layer, the concentration of nickel monotonically reduces from an interface with said intermediate layer towards a surface opposite to said interface.

2. The method for manufacturing a precursor according to claim 1 , wherein in said step of preparing a laminate metal, said laminate metal in which a second metal layer having higher strength than said first metal layer is formed under said first metal layer is prepared.

3. The method for manufacturing a precursor according to claim 1 , wherein in said step of preparing a laminate metal, said nickel layer has a thickness of 1 μm or more and 10 μm or less.

4. A method for manufacturing a superconducting wire comprising the steps of:

preparing a laminate metal having a first metal layer, and a non-alloyed nickel layer formed on said first metal layer;

forming an intermediate layer on said nickel layer of said laminate metal;

forming a superconducting layer on said intermediate layer; and

forming a nonmagnetic nickel alloy layer from said laminate metal by subjecting said laminate metal to a heat treatment after either one of said step of forming an intermediate layer and said step of forming a superconducting layer; wherein

in said nonmagnetic nickel alloy layer, the concentration of nickel monotonically reduces from an interface with said intermediate layer towards a surface opposite to said interface.

5. The method for manufacturing a superconducting wire according to claim 4 , wherein in said step of preparing a laminate metal, said laminate metal in which a second metal layer having higher strength than said first metal layer is formed under said first metal layer is prepared.

6. The method for manufacturing a superconducting wire according to claim 4 , wherein in said step of preparing a laminate metal, said nickel layer has a thickness of 1 μm or more and 10 μm or less.

7. The method for manufacturing a precursor according to claim 1 , wherein in the step of preparing the laminate metal, the non-alloyed nickel layer is directly deposited by plating on to the first metal layer.

8. The method for manufacturing a superconducting wire according to claim 4 , wherein in the step of preparing the laminate metal, the non-alloyed nickel layer is directly deposited by plating on to the first metal layer.

9. The method for manufacturing a precursor according to claim 1 , wherein the non-alloyed nickel layer is substantially thinner than the first metal layer.

10. The method for manufacturing a superconducting wire according to claim 4 , wherein the non-alloyed nickel layer is substantially thinner than the first metal layer.

Assignments (1)
CHANGE OF ADDRESS Recorded Jan 8, 2024
From: TOYO KOHAN CO., LTD.
To: TOYO KOHAN CO., LTD.
Reel/Frame 066208/0827 →
Priority Claims (1)
JP 2008-304153 · Nov 28, 2008 · national
Continuity (2)
Continuation 13131350
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