Method for separating high aspect ratio molecular structures
A method for moving high aspect ratio molecular structures (HARMS), which method comprises applying a force upon a dispersion comprising one or more bundled and individual HARM-structures, wherein the force moves the bundled and/or the individual HARM-structure based on one or more physical features and/or properties for substantially separating the bundled and individual HARM-structures from each other.
1. A method for separating bundled high aspect ratio molecular structures (HARMS) from individual high aspect ratio molecular structures (HARMS), comprising:
providing a gaseous dispersion having the bundled and individual HARMS, which include spontaneously charged bundled HARMS and substantially electrically neutral individual HARMS,
applying a DC-generated electric field onto the gaseous dispersion having the bundled and individual HARM-structures,
wherein a force generated by the applied electric field is applied on the spontaneously charged bundled HARMS to move the bundled HARM-structures to substantially separate the bundled from the individual HARM-structures.
2. The method according to claim 1 , wherein the method further comprises depositing one or more HARM-structures in a gaseous, liquid or solid dispersion and/or matrix and/or on a surface as a layer, pattern and/or structure.
3. The method according to claim 1 , wherein the method further comprises depositing the bundled or individual HARM-structure.
4. The method according to claim 1 , wherein the method further comprises depositing the bundled and individual HARM-structures.
5. The method according to claim 1 , wherein the bundled or individual HARM-structure comprises a nanotube, a carbon nanotube, a fullerene functionalized carbon nanotube, a boron-nitride nanotube, a nanorod including carbon, a phosphorous, boron, nitrogen and/or silicon containing nanorod, a filament or any other tube, rod or ribbon in individual or bundled form.
6. The method according to claim 1 , wherein the method further comprises adding one or more reactants, agents, coating materials, functionalizing materials, surfactants and/or dopants to the one or more HARM-structures.
7. The use of a method according to claim 1 , in the preparation of a functional material.
8. The use of a method according to claim 1 , in the preparation of a thick or thin film, a line, a wire, a pattern, a layered or three dimensional structure.
9. The use of a method according to claim 1 , in the preparation of a device.